Thermal investigations of integrated circuits and systems, THERMINIC'09

Research output: Contribution to journalArticle

Original languageEnglish
Article number010301
JournalJournal of Electronic Packaging, Transactions of the ASME
Volume133
Issue number1
DOIs
Publication statusPublished - 2011

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Integrated circuits
Hot Temperature

ASJC Scopus subject areas

  • Electrical and Electronic Engineering
  • Electronic, Optical and Magnetic Materials
  • Computer Science Applications
  • Mechanics of Materials

Cite this

Thermal investigations of integrated circuits and systems, THERMINIC'09. / Rencz, M.

In: Journal of Electronic Packaging, Transactions of the ASME, Vol. 133, No. 1, 010301, 2011.

Research output: Contribution to journalArticle

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