Thermal investigations of ics and systems (therminic)

M. Rencz, Clemens Lasance

Research output: Contribution to journalArticle

Original languageEnglish
Pages (from-to)321-322
Number of pages2
JournalJournal of Electronic Packaging, Transactions of the ASME
Volume123
Issue number4
DOIs
Publication statusPublished - Jan 1 2001

ASJC Scopus subject areas

  • Electronic, Optical and Magnetic Materials
  • Mechanics of Materials
  • Computer Science Applications
  • Electrical and Electronic Engineering

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