Thermal investigations of ICs and microstructures II

V. Székely, M. Rencz, B. Courtois

Research output: Contribution to journalArticle

Abstract

The 2nd THERMINIC Workshop in Budapest was held under the IEEE umbrella. The workshop attracted international scientists worldwide who are interested in the thermal behavior of integrated circuits, packages, electronic systems and microsystems. The main subjects of the 2nd THERMINIC Workshop included simulation, measurement, design, characterization and testing of the thermal and electro-thermal behavior of microelectronic elements and blocks.

Original languageEnglish
Pages (from-to)159-162
Number of pages4
JournalMicroelectronics Journal
Volume29
Issue number4-5
DOIs
Publication statusPublished - Apr 1998

Fingerprint

microstructure
Microstructure
microelectronics
integrated circuits
Microsystems
Microelectronics
Integrated circuits
electronics
simulation
Testing
Hot Temperature

ASJC Scopus subject areas

  • Control and Systems Engineering
  • Electrical and Electronic Engineering

Cite this

Thermal investigations of ICs and microstructures II. / Székely, V.; Rencz, M.; Courtois, B.

In: Microelectronics Journal, Vol. 29, No. 4-5, 04.1998, p. 159-162.

Research output: Contribution to journalArticle

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