Thermal evaluation and modelling of the SIP9 and SP10 MEMS packages

Marta Rencz, Vladimir Szekely, Zsolt Kohari, Bernard Courtois

Research output: Contribution to conferencePaper

2 Citations (Scopus)

Abstract

The SIP9 and SP10 packages are cheap plastic packages applicable for a broad range of MEMS applications. They are frequently used for packaging thermally operated MEMS, so knowing the thermal characteristics of the packages is very important. The paper presents an exhaustive thermal analysis of these packages, with various simulation tools and measurements. From the numerous experiments we draw conclusions not only about the thermal behaviour of the packages, but about the comparative features of the applied simulation and measurement tools as well. We compare the effectiveness of 2D and 3D simulation tools, discussing the advantages and drawbacks for the present applications. Both simulation based and measurement based transient thermal compact models are presented and evaluated.

Original languageEnglish
Pages120-126
Number of pages7
Publication statusPublished - Jan 1 2000
Event7th Intersociety Conference on Thermal and Thermomechanical Phenomena in Electronic Systems-ITherm 2000 - Las Vegas, NV, USA
Duration: May 23 2000May 26 2000

Other

Other7th Intersociety Conference on Thermal and Thermomechanical Phenomena in Electronic Systems-ITherm 2000
CityLas Vegas, NV, USA
Period5/23/005/26/00

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ASJC Scopus subject areas

  • Electronic, Optical and Magnetic Materials
  • Condensed Matter Physics
  • Electrical and Electronic Engineering
  • Materials Chemistry

Cite this

Rencz, M., Szekely, V., Kohari, Z., & Courtois, B. (2000). Thermal evaluation and modelling of the SIP9 and SP10 MEMS packages. 120-126. Paper presented at 7th Intersociety Conference on Thermal and Thermomechanical Phenomena in Electronic Systems-ITherm 2000, Las Vegas, NV, USA, .