Thermal evaluation and modelling of the SIP9 and SP10 MEMS packages

M. Rencz, V. Székely, Zsolt Kohari, Bernard Courtois

Research output: Chapter in Book/Report/Conference proceedingChapter

2 Citations (Scopus)

Abstract

The SIP9 and SP10 packages are cheap plastic packages applicable for a broad range of MEMS applications. They are frequently used for packaging thermally operated MEMS, so knowing the thermal characteristics of the packages is very important. The paper presents an exhaustive thermal analysis of these packages, with various simulation tools and measurements. From the numerous experiments we draw conclusions not only about the thermal behaviour of the packages, but about the comparative features of the applied simulation and measurement tools as well. We compare the effectiveness of 2D and 3D simulation tools, discussing the advantages and drawbacks for the present applications. Both simulation based and measurement based transient thermal compact models are presented and evaluated.

Original languageEnglish
Title of host publicationThermomechanical Phenomena in Electronic Systems -Proceedings of the Intersociety Conference
PublisherIEEE
Pages120-126
Number of pages7
Volume1
Publication statusPublished - 2000
Event7th Intersociety Conference on Thermal and Thermomechanical Phenomena in Electronic Systems-ITherm 2000 - Las Vegas, NV, USA
Duration: May 23 2000May 26 2000

Other

Other7th Intersociety Conference on Thermal and Thermomechanical Phenomena in Electronic Systems-ITherm 2000
CityLas Vegas, NV, USA
Period5/23/005/26/00

Fingerprint

MEMS
Thermoanalysis
Packaging
Plastics
Hot Temperature
Experiments

ASJC Scopus subject areas

  • Engineering(all)

Cite this

Rencz, M., Székely, V., Kohari, Z., & Courtois, B. (2000). Thermal evaluation and modelling of the SIP9 and SP10 MEMS packages. In Thermomechanical Phenomena in Electronic Systems -Proceedings of the Intersociety Conference (Vol. 1, pp. 120-126). IEEE.

Thermal evaluation and modelling of the SIP9 and SP10 MEMS packages. / Rencz, M.; Székely, V.; Kohari, Zsolt; Courtois, Bernard.

Thermomechanical Phenomena in Electronic Systems -Proceedings of the Intersociety Conference. Vol. 1 IEEE, 2000. p. 120-126.

Research output: Chapter in Book/Report/Conference proceedingChapter

Rencz, M, Székely, V, Kohari, Z & Courtois, B 2000, Thermal evaluation and modelling of the SIP9 and SP10 MEMS packages. in Thermomechanical Phenomena in Electronic Systems -Proceedings of the Intersociety Conference. vol. 1, IEEE, pp. 120-126, 7th Intersociety Conference on Thermal and Thermomechanical Phenomena in Electronic Systems-ITherm 2000, Las Vegas, NV, USA, 5/23/00.
Rencz M, Székely V, Kohari Z, Courtois B. Thermal evaluation and modelling of the SIP9 and SP10 MEMS packages. In Thermomechanical Phenomena in Electronic Systems -Proceedings of the Intersociety Conference. Vol. 1. IEEE. 2000. p. 120-126
Rencz, M. ; Székely, V. ; Kohari, Zsolt ; Courtois, Bernard. / Thermal evaluation and modelling of the SIP9 and SP10 MEMS packages. Thermomechanical Phenomena in Electronic Systems -Proceedings of the Intersociety Conference. Vol. 1 IEEE, 2000. pp. 120-126
@inbook{d88e56a87d0d45cf91176b7b417eec77,
title = "Thermal evaluation and modelling of the SIP9 and SP10 MEMS packages",
abstract = "The SIP9 and SP10 packages are cheap plastic packages applicable for a broad range of MEMS applications. They are frequently used for packaging thermally operated MEMS, so knowing the thermal characteristics of the packages is very important. The paper presents an exhaustive thermal analysis of these packages, with various simulation tools and measurements. From the numerous experiments we draw conclusions not only about the thermal behaviour of the packages, but about the comparative features of the applied simulation and measurement tools as well. We compare the effectiveness of 2D and 3D simulation tools, discussing the advantages and drawbacks for the present applications. Both simulation based and measurement based transient thermal compact models are presented and evaluated.",
author = "M. Rencz and V. Sz{\'e}kely and Zsolt Kohari and Bernard Courtois",
year = "2000",
language = "English",
volume = "1",
pages = "120--126",
booktitle = "Thermomechanical Phenomena in Electronic Systems -Proceedings of the Intersociety Conference",
publisher = "IEEE",

}

TY - CHAP

T1 - Thermal evaluation and modelling of the SIP9 and SP10 MEMS packages

AU - Rencz, M.

AU - Székely, V.

AU - Kohari, Zsolt

AU - Courtois, Bernard

PY - 2000

Y1 - 2000

N2 - The SIP9 and SP10 packages are cheap plastic packages applicable for a broad range of MEMS applications. They are frequently used for packaging thermally operated MEMS, so knowing the thermal characteristics of the packages is very important. The paper presents an exhaustive thermal analysis of these packages, with various simulation tools and measurements. From the numerous experiments we draw conclusions not only about the thermal behaviour of the packages, but about the comparative features of the applied simulation and measurement tools as well. We compare the effectiveness of 2D and 3D simulation tools, discussing the advantages and drawbacks for the present applications. Both simulation based and measurement based transient thermal compact models are presented and evaluated.

AB - The SIP9 and SP10 packages are cheap plastic packages applicable for a broad range of MEMS applications. They are frequently used for packaging thermally operated MEMS, so knowing the thermal characteristics of the packages is very important. The paper presents an exhaustive thermal analysis of these packages, with various simulation tools and measurements. From the numerous experiments we draw conclusions not only about the thermal behaviour of the packages, but about the comparative features of the applied simulation and measurement tools as well. We compare the effectiveness of 2D and 3D simulation tools, discussing the advantages and drawbacks for the present applications. Both simulation based and measurement based transient thermal compact models are presented and evaluated.

UR - http://www.scopus.com/inward/record.url?scp=0033677930&partnerID=8YFLogxK

UR - http://www.scopus.com/inward/citedby.url?scp=0033677930&partnerID=8YFLogxK

M3 - Chapter

AN - SCOPUS:0033677930

VL - 1

SP - 120

EP - 126

BT - Thermomechanical Phenomena in Electronic Systems -Proceedings of the Intersociety Conference

PB - IEEE

ER -