Thermal-electronic logic circuits: Scaling down

J. Mizsei, Márton C. Bein, Jyrki Lappalainen, László Juhász

Research output: Contribution to journalArticle

5 Citations (Scopus)

Abstract

The thermal-electronic logic circuit (TELC) concept is a possible way to overcome the scaling down problems of the conventional CMOS integrated circuits, which have a very complex structure nowadays. The basic component of the TELC is the semiconductor-metal transition (SMT) switch, which is an extremely simple bulk type device. This work evaluates the effect of the scaling down on characteristics of the VO2 thermal-electronic switch. Different types (lateral and vertical) of VO2 resistors have been produced using focused ion beams and pulsed laser deposition. The measured switching time strongly correlates with the characteristic size of the device. The energy consumption (power-delay product) of the scaled-down switching device is estimated as a sum of the energy needed for heating the thermal diffusion length sized environment of the device, heating the device itself and the latent heat of phase transition of VO2.

Original languageEnglish
JournalMicroelectronics Journal
DOIs
Publication statusAccepted/In press - Jun 8 2015

Fingerprint

logic circuits
Logic circuits
scaling
Switches
electronics
CMOS integrated circuits
Heating
Thermal diffusion
Focused ion beams
Latent heat
Pulsed laser deposition
Resistors
Transition metals
Energy utilization
Phase transitions
switching circuits
heating
Semiconductor materials
latent heat
energy consumption

Keywords

  • Nanoelectronic device
  • Phonsistor
  • Scaling
  • TELC
  • Vanadium dioxide

ASJC Scopus subject areas

  • Electrical and Electronic Engineering
  • Electronic, Optical and Magnetic Materials
  • Surfaces, Coatings and Films
  • Atomic and Molecular Physics, and Optics
  • Condensed Matter Physics

Cite this

Thermal-electronic logic circuits : Scaling down. / Mizsei, J.; Bein, Márton C.; Lappalainen, Jyrki; Juhász, László.

In: Microelectronics Journal, 08.06.2015.

Research output: Contribution to journalArticle

Mizsei, J. ; Bein, Márton C. ; Lappalainen, Jyrki ; Juhász, László. / Thermal-electronic logic circuits : Scaling down. In: Microelectronics Journal. 2015.
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