Thermal-electronic integrated logic

J. Mizsei, Jyrki Lappalainen, Marton C. Bein

Research output: Chapter in Book/Report/Conference proceedingConference contribution

8 Citations (Scopus)

Abstract

Most of the electrical components (transistors, resistors, etc.) are thermally sensitive elements. Thermal coupling between elements of integrated circuits is a well-known parasitic effect, which must be taken into account in the design process.

Original languageEnglish
Title of host publicationTHERMINIC 2013 - 19th International Workshop on Thermal Investigations of ICs and Systems, Proceedings
PublisherIEEE Computer Society
Pages344-347
Number of pages4
DOIs
Publication statusPublished - 2013
Event19th International Workshop on Thermal Investigations of ICs and Systems, THERMINIC 2013 - Berlin, Germany
Duration: Sep 25 2013Sep 27 2013

Other

Other19th International Workshop on Thermal Investigations of ICs and Systems, THERMINIC 2013
CountryGermany
CityBerlin
Period9/25/139/27/13

Fingerprint

Resistors
Integrated circuits
Transistors
Hot Temperature

ASJC Scopus subject areas

  • Hardware and Architecture

Cite this

Mizsei, J., Lappalainen, J., & Bein, M. C. (2013). Thermal-electronic integrated logic. In THERMINIC 2013 - 19th International Workshop on Thermal Investigations of ICs and Systems, Proceedings (pp. 344-347). [6675249] IEEE Computer Society. https://doi.org/10.1109/THERMINIC.2013.6675249

Thermal-electronic integrated logic. / Mizsei, J.; Lappalainen, Jyrki; Bein, Marton C.

THERMINIC 2013 - 19th International Workshop on Thermal Investigations of ICs and Systems, Proceedings. IEEE Computer Society, 2013. p. 344-347 6675249.

Research output: Chapter in Book/Report/Conference proceedingConference contribution

Mizsei, J, Lappalainen, J & Bein, MC 2013, Thermal-electronic integrated logic. in THERMINIC 2013 - 19th International Workshop on Thermal Investigations of ICs and Systems, Proceedings., 6675249, IEEE Computer Society, pp. 344-347, 19th International Workshop on Thermal Investigations of ICs and Systems, THERMINIC 2013, Berlin, Germany, 9/25/13. https://doi.org/10.1109/THERMINIC.2013.6675249
Mizsei J, Lappalainen J, Bein MC. Thermal-electronic integrated logic. In THERMINIC 2013 - 19th International Workshop on Thermal Investigations of ICs and Systems, Proceedings. IEEE Computer Society. 2013. p. 344-347. 6675249 https://doi.org/10.1109/THERMINIC.2013.6675249
Mizsei, J. ; Lappalainen, Jyrki ; Bein, Marton C. / Thermal-electronic integrated logic. THERMINIC 2013 - 19th International Workshop on Thermal Investigations of ICs and Systems, Proceedings. IEEE Computer Society, 2013. pp. 344-347
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