Thermal-electronic integrated logic

Janos Mizsei, Jyrki Lappalainen, Marton C. Bein

Research output: Contribution to conferencePaper

9 Citations (Scopus)

Abstract

Most of the electrical components (transistors, resistors, etc.) are thermally sensitive elements. Thermal coupling between elements of integrated circuits is a well-known parasitic effect, which must be taken into account in the design process.

Original languageEnglish
Pages344-347
Number of pages4
DOIs
Publication statusPublished - Jan 1 2013
Event19th International Workshop on Thermal Investigations of ICs and Systems, THERMINIC 2013 - Berlin, Germany
Duration: Sep 25 2013Sep 27 2013

Other

Other19th International Workshop on Thermal Investigations of ICs and Systems, THERMINIC 2013
CountryGermany
CityBerlin
Period9/25/139/27/13

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ASJC Scopus subject areas

  • Hardware and Architecture

Cite this

Mizsei, J., Lappalainen, J., & Bein, M. C. (2013). Thermal-electronic integrated logic. 344-347. Paper presented at 19th International Workshop on Thermal Investigations of ICs and Systems, THERMINIC 2013, Berlin, Germany. https://doi.org/10.1109/THERMINIC.2013.6675249