Thermal characterization of multi-die packages

Andrés Poppe, Yan Zhang, Gábor Farkas, Hon Wong, John Wilson, Péter Szabó

Research output: Chapter in Book/Report/Conference proceedingConference contribution

8 Citations (Scopus)

Abstract

Thermal measurement and modeling of multi-die packages became a hot topic recently in different fields like RAM chip packaging or LEDs and LED assemblies. In our present study, besides the overview of usual multi die packages, we present results for a more complex structure: an opto-coupler device with 4 chips in a combined lateral and vertical arrangement. The paper gives an overview of measurement and modeling techniques and it describes actual measurement results along with our structure function based methodology which helps validating the detailed model of the package being studied. Also, we show how one can derive junction-to-pin thermal resistances with a technique using structure functions.

Original languageEnglish
Title of host publication2006 8th Electronics Packaging Technology Conference, EPTC
Pages500-505
Number of pages6
DOIs
Publication statusPublished - Dec 1 2006
Event2006 8th Electronics Packaging Technology Conference, EPTC - , Singapore
Duration: Dec 6 2006Dec 8 2006

Publication series

NameProceedings of the Electronic Packaging Technology Conference, EPTC

Other

Other2006 8th Electronics Packaging Technology Conference, EPTC
CountrySingapore
Period12/6/0612/8/06

    Fingerprint

ASJC Scopus subject areas

  • Engineering(all)

Cite this

Poppe, A., Zhang, Y., Farkas, G., Wong, H., Wilson, J., & Szabó, P. (2006). Thermal characterization of multi-die packages. In 2006 8th Electronics Packaging Technology Conference, EPTC (pp. 500-505). [4147293] (Proceedings of the Electronic Packaging Technology Conference, EPTC). https://doi.org/10.1109/EPTC.2006.342764