Thermal characterization and of die packages

P. Szabo, M. Rencz, V. Székely, A. Poppe, G. Farkas, B. Courtois

Research output: Chapter in Book/Report/Conference proceedingConference contribution

Abstract

The main issues in the thermal characterization and modeling of stacked die packages are the appropriate model generation, and the qualification of the die attach quality between the different layers of the stacked die structures. The first part of the paper gives a short introduction of stacked die packages. The next chapter describes the main issues of steady state and transient compact model generation for the thermal behavior of stacked die packages. The third large part of the paper gives an overview of the different methodologies applied today for the quality characterization of the different die attach layers, as a major indicator of the reliability of the package.

Original languageEnglish
Title of host publicationProceedings of the ASME/Pacific Rim Technical Conference and Exhibition on Integration and Packaging of MEMS, NEMS, and Electronic Systems
Subtitle of host publicationAdvances in Electronic Packaging 2005
Pages1575-1581
Number of pages7
Publication statusPublished - Dec 1 2005
EventASME/Pacific Rim Technical Conference and Exhibition on Integration and Packaging of MEMS, NEMS, and Electronic Systems: Advances in Electronic Packaging 2005 - San Francisco, CA, United States
Duration: Jul 17 2005Jul 22 2005

Publication series

NameProceedings of the ASME/Pacific Rim Technical Conference and Exhibition on Integration and Packaging of MEMS, NEMS, and Electronic Systems: Advances in Electronic Packaging 2005
VolumePART B

Other

OtherASME/Pacific Rim Technical Conference and Exhibition on Integration and Packaging of MEMS, NEMS, and Electronic Systems: Advances in Electronic Packaging 2005
CountryUnited States
CitySan Francisco, CA
Period7/17/057/22/05

    Fingerprint

Keywords

  • Die attach qualification
  • Stacked dies packages
  • Steady state and dynamic compact modeling
  • Thermal transient measurements

ASJC Scopus subject areas

  • Engineering(all)

Cite this

Szabo, P., Rencz, M., Székely, V., Poppe, A., Farkas, G., & Courtois, B. (2005). Thermal characterization and of die packages. In Proceedings of the ASME/Pacific Rim Technical Conference and Exhibition on Integration and Packaging of MEMS, NEMS, and Electronic Systems: Advances in Electronic Packaging 2005 (pp. 1575-1581). (Proceedings of the ASME/Pacific Rim Technical Conference and Exhibition on Integration and Packaging of MEMS, NEMS, and Electronic Systems: Advances in Electronic Packaging 2005; Vol. PART B).