Thermal characterization and compact modeling of stacked die packages

P. Szabo, A. Poppe, G. Farkas, V. Székely, B. Courtois, M. Rencz

Research output: Chapter in Book/Report/Conference proceedingConference contribution

9 Citations (Scopus)

Abstract

In stacked die packages the main risk of the operation is, that any void or delamination in any of the die attach layers results in locally increased thermal resistance consequently may cause overheating and finally might result even in ruining the device. The first part of our paper discusses the methodology recommended to qualify and analyze the integrity of the die attach layers in stacked die packages. The methodology is based on thermal transient characterization and structure function evaluation. The second part of the paper discusses the issues of compact modeling of stacked die packages. Description of the thermal behavior with the Z matrix is suggested and presented on a pyramidal structure. It is demonstrated on a strongly pyramidal stacked die structure that the thermal behavior is strongly asymmetric, suggesting that a 2 resistor description of the thermal behavior would be rather erroneous.

Original languageEnglish
Title of host publicationTenth Intersociety Conference on Thermal and Thermomechanical Phenomena and Emerging Technologies in Electronic Systems, ITherm 2006
Pages251-257
Number of pages7
DOIs
Publication statusPublished - Dec 22 2006
Event10th Intersociety Conference on Thermal and Thermomechanical Phenomena and Emerging Technologies in Electronic Systems, ITherm 2006 - San Diego, CA, United States
Duration: May 30 2006Jun 2 2006

Publication series

NameThermomechanical Phenomena in Electronic Systems -Proceedings of the Intersociety Conference
Volume2006

Other

Other10th Intersociety Conference on Thermal and Thermomechanical Phenomena and Emerging Technologies in Electronic Systems, ITherm 2006
CountryUnited States
CitySan Diego, CA
Period5/30/066/2/06

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Keywords

  • Compact thermal modeling
  • Die attach qualification
  • Interface thermal resistance measurement
  • Stacked die packages
  • Structure function
  • Thermal transient measurements

ASJC Scopus subject areas

  • Electronic, Optical and Magnetic Materials
  • Condensed Matter Physics
  • Electrical and Electronic Engineering
  • Materials Chemistry

Cite this

Szabo, P., Poppe, A., Farkas, G., Székely, V., Courtois, B., & Rencz, M. (2006). Thermal characterization and compact modeling of stacked die packages. In Tenth Intersociety Conference on Thermal and Thermomechanical Phenomena and Emerging Technologies in Electronic Systems, ITherm 2006 (pp. 251-257). [1645350] (Thermomechanical Phenomena in Electronic Systems -Proceedings of the Intersociety Conference; Vol. 2006). https://doi.org/10.1109/ITHERM.2006.1645350