Formation of 3C silicon carbide (SiC) inclusions in 4H SiC epitaxial layers has been investigated using defect revealing techniques and transmission electron microscopy. The nucleation mechanism of 3C is shown to relate to the formation of triangular stacking faults (TSFs) induced by substrate imperfections and surface defects. The TSFs modify the surface morphology by forming large (0001) surface terraces. A high local supersaturation at the TSF regions results in the spontaneous nucleation of 3C, in a manner similar to that which occurs on on-axis SiC substrates. Depending on the defect that gives rise to the TSF, the 3C inclusions may be completely overgrown by 4H polytype only leaving a striation at the edge.
- Stacking fault
- Transmission electron microscopy (TEM)
ASJC Scopus subject areas
- Electronic, Optical and Magnetic Materials
- Mechanical Engineering
- Materials Chemistry
- Electrical and Electronic Engineering