The influence of the cycling parameters on the reliability test results of IGBTs

Zoltan Sarkany, M. Rencz

Research output: Chapter in Book/Report/Conference proceedingConference contribution

Abstract

One of the most common reliability test method used for lifetime testing of IGBT power modules is the power (active) cycling. Despite it is a relatively simple test method, there are numerous aspects that need to be considered. In this paper the importance of the electrical setup, how the device is powered and the control strategy, how the test parameters are regulated are investigated and evaluated.

Original languageEnglish
Title of host publication2017 IEEE 19th Electronics Packaging Technology Conference, EPTC 2017
PublisherInstitute of Electrical and Electronics Engineers Inc.
Pages1-4
Number of pages4
Volume2018-February
ISBN (Electronic)9781538630426
DOIs
Publication statusPublished - Jan 31 2018
Event2017 19th IEEE Electronics Packaging Technology Conference, EPTC 2017 - Singapore, Singapore
Duration: Dec 6 2017Dec 9 2017

Other

Other2017 19th IEEE Electronics Packaging Technology Conference, EPTC 2017
CountrySingapore
CitySingapore
Period12/6/1712/9/17

ASJC Scopus subject areas

  • Electrical and Electronic Engineering
  • Electronic, Optical and Magnetic Materials
  • Metals and Alloys
  • Polymers and Plastics

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  • Cite this

    Sarkany, Z., & Rencz, M. (2018). The influence of the cycling parameters on the reliability test results of IGBTs. In 2017 IEEE 19th Electronics Packaging Technology Conference, EPTC 2017 (Vol. 2018-February, pp. 1-4). Institute of Electrical and Electronics Engineers Inc.. https://doi.org/10.1109/EPTC.2017.8277513