The influence of Mo addition on the microstructure and its thermal stability for electrodeposited Ni films

Garima Kapoor, L. Péter, Éva Fekete, J. Lábár, J. Gubicza

Research output: Contribution to journalArticle

4 Citations (Scopus)

Abstract

An investigation was conducted to study the effect of molybdenum (Mo) alloying on the grain size and lattice defect structure in nanocrystalline nickel (Ni) films processed by electrodeposition. Moreover, the influence of saccharin addition to the electrolyte bath on the microstructure of Ni-Mo layers with low and high Mo contents was studied. It was found that the higher Mo content resulted in a larger dislocation density and twin fault probability as well as a smaller grain size. The addition of saccharin to the bath resulted in a further increase in the density of both dislocations and twin faults. It was also revealed that Mo alloying improved the thermal stability of the nanostructure in Ni films while saccharin addition yielded a reduction of stability. The reasons for these opposite behaviors were discussed in detail. In addition, the defect structure and its stability in Ni-Mo layers were compared with that for fine-grained bulk samples with the same composition but processed by severe plastic deformation.

Original languageEnglish
Pages (from-to)563-572
Number of pages10
JournalMaterials Characterization
Volume145
DOIs
Publication statusPublished - Nov 1 2018

Fingerprint

Molybdenum
Nickel
molybdenum
Thermodynamic stability
thermal stability
nickel
Saccharin
microstructure
Microstructure
Defect structures
Alloying
alloying
baths
grain size
Crystal defects
defects
Electrodeposition
electrodeposition
Electrolytes
plastic deformation

Keywords

  • Dislocation
  • Electrodeposition
  • Microstructure
  • Mo addition
  • Ni-Mo alloys
  • Thermal stability

ASJC Scopus subject areas

  • Materials Science(all)
  • Condensed Matter Physics
  • Mechanics of Materials
  • Mechanical Engineering

Cite this

The influence of Mo addition on the microstructure and its thermal stability for electrodeposited Ni films. / Kapoor, Garima; Péter, L.; Fekete, Éva; Lábár, J.; Gubicza, J.

In: Materials Characterization, Vol. 145, 01.11.2018, p. 563-572.

Research output: Contribution to journalArticle

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