The effect of oxygen on the structure and growth morphology of vapour deposited Cu films

F. M. Reicha, M. El Hiti, P. Barna

Research output: Contribution to journalArticle

2 Citations (Scopus)

Abstract

The effect of oxygen on the structural development of evaporated copper films was studied. Results of TEM and SEM investigations revealed a correlation of the surface growth morphology and the grain size distribution to the partial pressure of oxygen and the film thickness. The development of growth hillocks is interpreted by considering a crystal face dependence of surface microchemistry.

Original languageEnglish
Pages (from-to)93-96
Number of pages4
JournalVacuum
Volume37
Issue number1-2
DOIs
Publication statusPublished - 1987

Fingerprint

Vapors
vapors
Oxygen
oxygen
Partial pressure
partial pressure
Film thickness
Copper
film thickness
grain size
Transmission electron microscopy
copper
transmission electron microscopy
Crystals
Scanning electron microscopy
scanning electron microscopy
crystals

ASJC Scopus subject areas

  • Surfaces, Coatings and Films
  • Condensed Matter Physics
  • Surfaces and Interfaces

Cite this

The effect of oxygen on the structure and growth morphology of vapour deposited Cu films. / Reicha, F. M.; El Hiti, M.; Barna, P.

In: Vacuum, Vol. 37, No. 1-2, 1987, p. 93-96.

Research output: Contribution to journalArticle

Reicha, F. M. ; El Hiti, M. ; Barna, P. / The effect of oxygen on the structure and growth morphology of vapour deposited Cu films. In: Vacuum. 1987 ; Vol. 37, No. 1-2. pp. 93-96.
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