The effect of chloride ion concentration on electrochemical migration of copper

Bálint Medgyes, Xiankang Zhong, G. Harsányi

Research output: Contribution to journalArticle

15 Citations (Scopus)

Abstract

The effect of chloride ion concentration of electrochemical migration (ECM) was investigated on copper applying in situ electrochemical, optical and scanning electron microscopy—energy dispersive X-ray spectroscopy methods. An unexpected phenomenon was found: copper dendrite grows not only at low chloride concentration, but also at high and even saturated chloride concentrations, although it is generally suggested that the growth of copper dendrite through ECM does not take place in high chloride concentration solutions. Reactions have been proposed to explain the ECM of copper under different chloride concentration levels.

Original languageEnglish
Pages (from-to)2010-2015
Number of pages6
JournalJournal of Materials Science: Materials in Electronics
Volume26
Issue number4
DOIs
Publication statusPublished - 2015

Fingerprint

ion concentration
Chlorides
Copper
chlorides
Ions
copper
dendrites
Dendrites
X ray spectroscopy
Spectrum Analysis
Scanning
X-Rays
Electrons
scanning
Growth
spectroscopy
electrons
x rays

ASJC Scopus subject areas

  • Condensed Matter Physics
  • Atomic and Molecular Physics, and Optics
  • Electronic, Optical and Magnetic Materials
  • Electrical and Electronic Engineering

Cite this

The effect of chloride ion concentration on electrochemical migration of copper. / Medgyes, Bálint; Zhong, Xiankang; Harsányi, G.

In: Journal of Materials Science: Materials in Electronics, Vol. 26, No. 4, 2015, p. 2010-2015.

Research output: Contribution to journalArticle

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