The correlation between the mechanical and electrochemical properties of solder joints

Tamás Hurtony, P. Gordon

Research output: Chapter in Book/Report/Conference proceedingConference contribution

2 Citations (Scopus)

Abstract

The mechanical properties of a solder joint is partially determined by the microstructure of the solder. This microstructure is formed during the soldering process and it highly depends on the technological parameters. We have introduced a new selective electrochemical sample preparation method in which the tin phases can be removed from a cross-section of a solder joint, while the intermetallic phases stay intact. For the quantitative characterization of the revealed intermetallic microstructure we also introduced a novel method. We compare the electrochemical impedance spectrum of the polished surface of the cross-sectioned sample to the spectrum measured after the selective material removal. The peak shear force values of components soldered with different cooling rates are compared to a composed arbitrary unit which is proportional to the total surface of the intermetallic compounds in the solder bulk.

Original languageEnglish
Title of host publicationProceedings of the International Spring Seminar on Electronics Technology
PublisherIEEE Computer Society
Pages70-74
Number of pages5
Volume2015-September
ISBN (Print)9781479988600
DOIs
Publication statusPublished - Sep 9 2015
Event38th International Spring Seminar on Electronics Technology, ISSE 2015 - Eger, Hungary
Duration: May 6 2015May 10 2015

Other

Other38th International Spring Seminar on Electronics Technology, ISSE 2015
CountryHungary
CityEger
Period5/6/155/10/15

ASJC Scopus subject areas

  • Electrical and Electronic Engineering
  • Safety, Risk, Reliability and Quality

Fingerprint Dive into the research topics of 'The correlation between the mechanical and electrochemical properties of solder joints'. Together they form a unique fingerprint.

  • Cite this

    Hurtony, T., & Gordon, P. (2015). The correlation between the mechanical and electrochemical properties of solder joints. In Proceedings of the International Spring Seminar on Electronics Technology (Vol. 2015-September, pp. 70-74). [7247965] IEEE Computer Society. https://doi.org/10.1109/ISSE.2015.7247965