Testing the die attach quality of 3D stacked dies

M. Rencz, A. Pappe, N. Howard, V. Székely, B. Courtois, L. Zhang, L. Nguyen

Research output: Contribution to conferencePaper

1 Citation (Scopus)

Abstract

The paper presents the structure function based methodologies for testing the die attach quality of packages containing stacked dies. After the presentation of the theoretical background several measured test series are presented to demonstrate the use and the advantages of the method. The method is applicable for the fast diagnosis of the die-attach problems of stacked dies, and it does not require any additional circuit elements in any of the stacked dies.

Original languageEnglish
Pages249-256
Number of pages8
DOIs
Publication statusPublished - Dec 1 2004
Event2004 ASME International Mechanical Engineering Congress and Exposition, IMECE 2004 - Anaheim, CA, United States
Duration: Nov 13 2004Nov 19 2004

Other

Other2004 ASME International Mechanical Engineering Congress and Exposition, IMECE 2004
CountryUnited States
CityAnaheim, CA
Period11/13/0411/19/04

ASJC Scopus subject areas

  • Mechanical Engineering
  • Electrical and Electronic Engineering

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  • Cite this

    Rencz, M., Pappe, A., Howard, N., Székely, V., Courtois, B., Zhang, L., & Nguyen, L. (2004). Testing the die attach quality of 3D stacked dies. 249-256. Paper presented at 2004 ASME International Mechanical Engineering Congress and Exposition, IMECE 2004, Anaheim, CA, United States. https://doi.org/10.1115/IMECE2004-62418