Test structure for thermal monitoring

V. Székely, Zs Kohari, Cs Marta, M. Rencz, B. Courtois

Research output: Chapter in Book/Report/Conference proceedingConference contribution

2 Citations (Scopus)

Abstract

The paper is dealing with thermal test structures for CMOS ICs. A new temperature sensor/test structure is proposed: the Thermal Feedback Oscillator (TFO). Detailed design considerations are presented together with experimental results. Moreover the paper general questions of the 'design for thermal testability' (DfTT) principle including both the problems of placement of the test structures and possible solutions for the read-out of the test data.

Original languageEnglish
Title of host publicationIEEE International Conference on Microelectronic Test Structures
PublisherIEEE
Pages111-115
Number of pages5
Publication statusPublished - 1996
EventProceedings of the 1996 IEEE International Conference on Microelectronic Test Structures, ICMTS - Trento, Italy
Duration: Mar 25 1996Mar 28 1996

Other

OtherProceedings of the 1996 IEEE International Conference on Microelectronic Test Structures, ICMTS
CityTrento, Italy
Period3/25/963/28/96

Fingerprint

Monitoring
Temperature sensors
Feedback
Hot Temperature

ASJC Scopus subject areas

  • Electrical and Electronic Engineering

Cite this

Székely, V., Kohari, Z., Marta, C., Rencz, M., & Courtois, B. (1996). Test structure for thermal monitoring. In IEEE International Conference on Microelectronic Test Structures (pp. 111-115). IEEE.

Test structure for thermal monitoring. / Székely, V.; Kohari, Zs; Marta, Cs; Rencz, M.; Courtois, B.

IEEE International Conference on Microelectronic Test Structures. IEEE, 1996. p. 111-115.

Research output: Chapter in Book/Report/Conference proceedingConference contribution

Székely, V, Kohari, Z, Marta, C, Rencz, M & Courtois, B 1996, Test structure for thermal monitoring. in IEEE International Conference on Microelectronic Test Structures. IEEE, pp. 111-115, Proceedings of the 1996 IEEE International Conference on Microelectronic Test Structures, ICMTS, Trento, Italy, 3/25/96.
Székely V, Kohari Z, Marta C, Rencz M, Courtois B. Test structure for thermal monitoring. In IEEE International Conference on Microelectronic Test Structures. IEEE. 1996. p. 111-115
Székely, V. ; Kohari, Zs ; Marta, Cs ; Rencz, M. ; Courtois, B. / Test structure for thermal monitoring. IEEE International Conference on Microelectronic Test Structures. IEEE, 1996. pp. 111-115
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