Successive network reduction method for parametric transient results

Marton Nemeth, A. Poppe

Research output: Chapter in Book/Report/Conference proceedingConference contribution

2 Citations (Scopus)

Abstract

In this paper we present a new, direct computational method for calculating the complex thermal transfer impedances between two separate locations of a given physical structure aimed at the implementation into a field-solver based on the SUNRED (SUccessive Node REDuction) algorithm. We tested the method with a simple 2D example containing 125 internal nodes. For testing the proposed new calculation method multiple combinations of Dirichlet and Neumann type boundary conditions were applied. Also, different types of thermal loads such as prescribed unit-step change in dissipation or temperature were assumed (for time domain transient analysis). The test case was also studied with the assumption of sinusoidal dissipation. Results obtained by the proposed new calculation method and results obtained by conventional simulations differ less than the uncertainty of the traditional solution method. The good agreement enables us to use the balanced truncation method to reduce the order of the transfer functions with low computational cost.

Original languageEnglish
Title of host publicationSymposium on Design, Test, Integration and Packaging of MEMS/MOEMS, DTIP 2017
PublisherInstitute of Electrical and Electronics Engineers Inc.
ISBN (Electronic)9781538629529
DOIs
Publication statusPublished - Jul 18 2017
Event19th Symposium on Design, Test, Integration and Packaging of MEMS/MOEMS, DTIP 2017 - Bordeaux, France
Duration: May 29 2017Jun 1 2017

Other

Other19th Symposium on Design, Test, Integration and Packaging of MEMS/MOEMS, DTIP 2017
CountryFrance
CityBordeaux
Period5/29/176/1/17

Fingerprint

Thermal load
Computational methods
Transient analysis
Transfer functions
Boundary conditions
Testing
Costs
Temperature
Hot Temperature
Uncertainty

Keywords

  • compact thermal modeling
  • node reduction
  • thermal transfer functions

ASJC Scopus subject areas

  • Electrical and Electronic Engineering
  • Mechanical Engineering
  • Safety, Risk, Reliability and Quality
  • Electronic, Optical and Magnetic Materials

Cite this

Nemeth, M., & Poppe, A. (2017). Successive network reduction method for parametric transient results. In Symposium on Design, Test, Integration and Packaging of MEMS/MOEMS, DTIP 2017 [7984460] Institute of Electrical and Electronics Engineers Inc.. https://doi.org/10.1109/DTIP.2017.7984460

Successive network reduction method for parametric transient results. / Nemeth, Marton; Poppe, A.

Symposium on Design, Test, Integration and Packaging of MEMS/MOEMS, DTIP 2017. Institute of Electrical and Electronics Engineers Inc., 2017. 7984460.

Research output: Chapter in Book/Report/Conference proceedingConference contribution

Nemeth, M & Poppe, A 2017, Successive network reduction method for parametric transient results. in Symposium on Design, Test, Integration and Packaging of MEMS/MOEMS, DTIP 2017., 7984460, Institute of Electrical and Electronics Engineers Inc., 19th Symposium on Design, Test, Integration and Packaging of MEMS/MOEMS, DTIP 2017, Bordeaux, France, 5/29/17. https://doi.org/10.1109/DTIP.2017.7984460
Nemeth M, Poppe A. Successive network reduction method for parametric transient results. In Symposium on Design, Test, Integration and Packaging of MEMS/MOEMS, DTIP 2017. Institute of Electrical and Electronics Engineers Inc. 2017. 7984460 https://doi.org/10.1109/DTIP.2017.7984460
Nemeth, Marton ; Poppe, A. / Successive network reduction method for parametric transient results. Symposium on Design, Test, Integration and Packaging of MEMS/MOEMS, DTIP 2017. Institute of Electrical and Electronics Engineers Inc., 2017.
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