Study of the underpotential deposition of copper onto polycrystalline palladium surfaces

S. Szabó, I. Bakos, F. Nagy, T. Mallát

Research output: Contribution to journalArticle

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Abstract

The underpotential deposition of copper onto a palladized Pt electrode has been studied. It has been shown that Cl- ion traces and adsorbed Cu atoms form a catalyst on the Pd surface which accelerates Pd corrosion during the desorption of adsorbed Cu. The Pd2+ ions formed in this corrosion process may bring about Cu/Pd alloy deposition, suggesting alloy formation owing to copper absorption. The quantities of copper and oxygen adsorbed on the same palladium surface are roughly equal. A mechanism of copper deposition via ionization of presorbed hydrogen is proposed.

Original languageEnglish
Pages (from-to)137-146
Number of pages10
JournalJournal of Electroanalytical Chemistry
Volume263
Issue number1
DOIs
Publication statusPublished - May 10 1989

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Palladium
Copper
Ions
Corrosion
Ionization
Hydrogen
Desorption
Oxygen
Atoms
Electrodes
Catalysts

ASJC Scopus subject areas

  • Chemical Engineering(all)
  • Analytical Chemistry
  • Electrochemistry

Cite this

Study of the underpotential deposition of copper onto polycrystalline palladium surfaces. / Szabó, S.; Bakos, I.; Nagy, F.; Mallát, T.

In: Journal of Electroanalytical Chemistry, Vol. 263, No. 1, 10.05.1989, p. 137-146.

Research output: Contribution to journalArticle

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