Studies with transient compact models of packages and heat sinks

M. Rencz, V. Székely, B. Courtois

Research output: Chapter in Book/Report/Conference proceedingConference contribution

Abstract

This paper deals with the application of dynamic compact thermal models of packages. First an algorithm and a methodology is presented, that was developed for the inclusion of compact electrical RC thermal models of packages into field solvers, to enable fast board level simulation with compact models of packages. Application examples demonstrate the advantages of the method. In the second part of the paper a method is presented for the generation of nonlinear compact models. Simulation experiments comparing linear and nonlinear compact models show that for small temperature excursions the use of linear models is acceptable, but in case of larger than 80°C temperature increases the use of linear models results in an about 20-30% regular error for the usual package structures.

Original languageEnglish
Title of host publicationAdvances in Electronic Packaging
Pages295-302
Number of pages8
Volume1
Publication statusPublished - 2003
Event2003 International Electronic Packaging Technical Conference and Exhibition - Haui, HI, United States
Duration: Jul 6 2003Jul 11 2003

Other

Other2003 International Electronic Packaging Technical Conference and Exhibition
CountryUnited States
CityHaui, HI
Period7/6/037/11/03

Fingerprint

Heat sinks
Temperature

ASJC Scopus subject areas

  • Engineering(all)
  • Electrical and Electronic Engineering
  • Electronic, Optical and Magnetic Materials

Cite this

Rencz, M., Székely, V., & Courtois, B. (2003). Studies with transient compact models of packages and heat sinks. In Advances in Electronic Packaging (Vol. 1, pp. 295-302)

Studies with transient compact models of packages and heat sinks. / Rencz, M.; Székely, V.; Courtois, B.

Advances in Electronic Packaging. Vol. 1 2003. p. 295-302.

Research output: Chapter in Book/Report/Conference proceedingConference contribution

Rencz, M, Székely, V & Courtois, B 2003, Studies with transient compact models of packages and heat sinks. in Advances in Electronic Packaging. vol. 1, pp. 295-302, 2003 International Electronic Packaging Technical Conference and Exhibition, Haui, HI, United States, 7/6/03.
Rencz M, Székely V, Courtois B. Studies with transient compact models of packages and heat sinks. In Advances in Electronic Packaging. Vol. 1. 2003. p. 295-302
Rencz, M. ; Székely, V. ; Courtois, B. / Studies with transient compact models of packages and heat sinks. Advances in Electronic Packaging. Vol. 1 2003. pp. 295-302
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