Studies on the nonlinearity effects in dynamic compact model generation of packages

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53 Citations (Scopus)

Abstract

In this paper, we present a series of measurement and simulation experiments that were accomplished to check the order of magnitude of the error caused by neglecting the temperature dependence of the dynamic compact models of packages. We present a methodology to create nonlinear, temperature dependent compact models. With this methodology we created temperature dependent compact models of packages based both on measured and simulated results and compared the behavior of the temperature dependent model to the temperature independent (linear) model. We have found that neglecting the nonlinearity is acceptable in a moderate temperature range. If the temperature excursion remains below 60-80°C the error is expected to be less than 2-3%. For higher temperature rise the use of nonlinear compact models is recommended.

Original languageEnglish
Pages (from-to)124-130
Number of pages7
JournalIEEE Transactions on Components and Packaging Technologies
Volume27
Issue number1
DOIs
Publication statusPublished - Mar 2004

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Temperature
Experiments

Keywords

  • Compact thermal modeling
  • Dynamic compact models
  • Nonlinear compact models
  • Temperature dependent models

ASJC Scopus subject areas

  • Electrical and Electronic Engineering
  • Industrial and Manufacturing Engineering
  • Materials Science(all)

Cite this

@article{8bf8fbb88a8b4fcaa83e7f5d9981e9de,
title = "Studies on the nonlinearity effects in dynamic compact model generation of packages",
abstract = "In this paper, we present a series of measurement and simulation experiments that were accomplished to check the order of magnitude of the error caused by neglecting the temperature dependence of the dynamic compact models of packages. We present a methodology to create nonlinear, temperature dependent compact models. With this methodology we created temperature dependent compact models of packages based both on measured and simulated results and compared the behavior of the temperature dependent model to the temperature independent (linear) model. We have found that neglecting the nonlinearity is acceptable in a moderate temperature range. If the temperature excursion remains below 60-80°C the error is expected to be less than 2-3{\%}. For higher temperature rise the use of nonlinear compact models is recommended.",
keywords = "Compact thermal modeling, Dynamic compact models, Nonlinear compact models, Temperature dependent models",
author = "M. Rencz and V. Sz{\'e}kely",
year = "2004",
month = "3",
doi = "10.1109/TCAPT.2004.825750",
language = "English",
volume = "27",
pages = "124--130",
journal = "IEEE Transactions on Components and Packaging Technologies",
issn = "1521-3331",
publisher = "Institute of Electrical and Electronics Engineers Inc.",
number = "1",

}

TY - JOUR

T1 - Studies on the nonlinearity effects in dynamic compact model generation of packages

AU - Rencz, M.

AU - Székely, V.

PY - 2004/3

Y1 - 2004/3

N2 - In this paper, we present a series of measurement and simulation experiments that were accomplished to check the order of magnitude of the error caused by neglecting the temperature dependence of the dynamic compact models of packages. We present a methodology to create nonlinear, temperature dependent compact models. With this methodology we created temperature dependent compact models of packages based both on measured and simulated results and compared the behavior of the temperature dependent model to the temperature independent (linear) model. We have found that neglecting the nonlinearity is acceptable in a moderate temperature range. If the temperature excursion remains below 60-80°C the error is expected to be less than 2-3%. For higher temperature rise the use of nonlinear compact models is recommended.

AB - In this paper, we present a series of measurement and simulation experiments that were accomplished to check the order of magnitude of the error caused by neglecting the temperature dependence of the dynamic compact models of packages. We present a methodology to create nonlinear, temperature dependent compact models. With this methodology we created temperature dependent compact models of packages based both on measured and simulated results and compared the behavior of the temperature dependent model to the temperature independent (linear) model. We have found that neglecting the nonlinearity is acceptable in a moderate temperature range. If the temperature excursion remains below 60-80°C the error is expected to be less than 2-3%. For higher temperature rise the use of nonlinear compact models is recommended.

KW - Compact thermal modeling

KW - Dynamic compact models

KW - Nonlinear compact models

KW - Temperature dependent models

UR - http://www.scopus.com/inward/record.url?scp=2442447000&partnerID=8YFLogxK

UR - http://www.scopus.com/inward/citedby.url?scp=2442447000&partnerID=8YFLogxK

U2 - 10.1109/TCAPT.2004.825750

DO - 10.1109/TCAPT.2004.825750

M3 - Article

AN - SCOPUS:2442447000

VL - 27

SP - 124

EP - 130

JO - IEEE Transactions on Components and Packaging Technologies

JF - IEEE Transactions on Components and Packaging Technologies

SN - 1521-3331

IS - 1

ER -