Studies on the heat removal features of stacked SOI structures with a dedicated field solver program (SUNRED)

Zs Kohári, V. Székely, M. Rencz, A. Páhl, V. Dudek, B. Höfflinger

Research output: Contribution to journalArticle

10 Citations (Scopus)

Abstract

This paper gives the latest results of our studies on the thermal behaviour of SOI structures. The influence of changing certain geometrical parameters of the structure on the thermal properties was examined. A new two-dimensional field solver program was developed to achieve better accuracy which also made heat flow visualization possible.

Original languageEnglish
Pages (from-to)1881-1891
Number of pages11
JournalMicroelectronics Reliability
Volume38
Issue number12
DOIs
Publication statusPublished - Jan 1 1998

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ASJC Scopus subject areas

  • Electronic, Optical and Magnetic Materials
  • Atomic and Molecular Physics, and Optics
  • Safety, Risk, Reliability and Quality
  • Condensed Matter Physics
  • Surfaces, Coatings and Films
  • Electrical and Electronic Engineering

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