Studies on the heat removal features of stacked SOI structures with a dedicated field solver program (SUNRED)

Zs Kohári, V. Székely, M. Rencz, A. Páhl, V. Dudek, B. Höfflinger

Research output: Contribution to journalArticle

10 Citations (Scopus)

Abstract

This paper gives the latest results of our studies on the thermal behaviour of SOI structures. The influence of changing certain geometrical parameters of the structure on the thermal properties was examined. A new two-dimensional field solver program was developed to achieve better accuracy which also made heat flow visualization possible.

Original languageEnglish
Pages (from-to)1881-1891
Number of pages11
JournalMicroelectronics Reliability
Volume38
Issue number12
Publication statusPublished - 1998

Fingerprint

flow visualization
SOI (semiconductors)
Flow visualization
heat transmission
Thermodynamic properties
thermodynamic properties
Heat transfer
heat
Hot Temperature

ASJC Scopus subject areas

  • Control and Systems Engineering
  • Electrical and Electronic Engineering

Cite this

Studies on the heat removal features of stacked SOI structures with a dedicated field solver program (SUNRED). / Kohári, Zs; Székely, V.; Rencz, M.; Páhl, A.; Dudek, V.; Höfflinger, B.

In: Microelectronics Reliability, Vol. 38, No. 12, 1998, p. 1881-1891.

Research output: Contribution to journalArticle

@article{f5c5761b0a9648b3886bb56bb4ea4a93,
title = "Studies on the heat removal features of stacked SOI structures with a dedicated field solver program (SUNRED)",
abstract = "This paper gives the latest results of our studies on the thermal behaviour of SOI structures. The influence of changing certain geometrical parameters of the structure on the thermal properties was examined. A new two-dimensional field solver program was developed to achieve better accuracy which also made heat flow visualization possible.",
author = "Zs Koh{\'a}ri and V. Sz{\'e}kely and M. Rencz and A. P{\'a}hl and V. Dudek and B. H{\"o}fflinger",
year = "1998",
language = "English",
volume = "38",
pages = "1881--1891",
journal = "Microelectronics and Reliability",
issn = "0026-2714",
publisher = "Elsevier Limited",
number = "12",

}

TY - JOUR

T1 - Studies on the heat removal features of stacked SOI structures with a dedicated field solver program (SUNRED)

AU - Kohári, Zs

AU - Székely, V.

AU - Rencz, M.

AU - Páhl, A.

AU - Dudek, V.

AU - Höfflinger, B.

PY - 1998

Y1 - 1998

N2 - This paper gives the latest results of our studies on the thermal behaviour of SOI structures. The influence of changing certain geometrical parameters of the structure on the thermal properties was examined. A new two-dimensional field solver program was developed to achieve better accuracy which also made heat flow visualization possible.

AB - This paper gives the latest results of our studies on the thermal behaviour of SOI structures. The influence of changing certain geometrical parameters of the structure on the thermal properties was examined. A new two-dimensional field solver program was developed to achieve better accuracy which also made heat flow visualization possible.

UR - http://www.scopus.com/inward/record.url?scp=0032318257&partnerID=8YFLogxK

UR - http://www.scopus.com/inward/citedby.url?scp=0032318257&partnerID=8YFLogxK

M3 - Article

AN - SCOPUS:0032318257

VL - 38

SP - 1881

EP - 1891

JO - Microelectronics and Reliability

JF - Microelectronics and Reliability

SN - 0026-2714

IS - 12

ER -