Structure function evaluation of stacked dies

Research output: Chapter in Book/Report/Conference proceedingConference contribution

62 Citations (Scopus)

Abstract

In this paper simulation experiments demonstrate, that the structure function evaluation of the thermal transient testing is capable to locate die attach failure(s) of stacked die packages. The strength and the location of the die attach failure may be determined with the methodology of a fast thermal transient measurement and the subsequent computer evaluation. The special advantage of the methodology is that normally it does not require any additional circuit elements on any of the dies of the stacked die structure. The paper demonstrates the feasibility of the method both for stacked die structures of the same die size, and for pyramidal stacked die packages.

Original languageEnglish
Title of host publicationAnnual IEEE Semiconductor Thermal Measurement and Management Symposium
Pages50-54
Number of pages5
Volume20
Publication statusPublished - 2004
Event20th Annual IEEE Semiconductor Thermal Measurement and Management Symposium - Proceedings 2004 - San Jose, CA., United States
Duration: Mar 9 2004Mar 11 2004

Other

Other20th Annual IEEE Semiconductor Thermal Measurement and Management Symposium - Proceedings 2004
CountryUnited States
CitySan Jose, CA.
Period3/9/043/11/04

Fingerprint

Function evaluation
evaluation
methodology
Networks (circuits)
Testing

Keywords

  • Die attach quality
  • Reliability testing
  • Structure function
  • Thermal transient testing

ASJC Scopus subject areas

  • Electrical and Electronic Engineering
  • Instrumentation

Cite this

Rencz, M., & Székely, V. (2004). Structure function evaluation of stacked dies. In Annual IEEE Semiconductor Thermal Measurement and Management Symposium (Vol. 20, pp. 50-54)

Structure function evaluation of stacked dies. / Rencz, M.; Székely, V.

Annual IEEE Semiconductor Thermal Measurement and Management Symposium. Vol. 20 2004. p. 50-54.

Research output: Chapter in Book/Report/Conference proceedingConference contribution

Rencz, M & Székely, V 2004, Structure function evaluation of stacked dies. in Annual IEEE Semiconductor Thermal Measurement and Management Symposium. vol. 20, pp. 50-54, 20th Annual IEEE Semiconductor Thermal Measurement and Management Symposium - Proceedings 2004, San Jose, CA., United States, 3/9/04.
Rencz M, Székely V. Structure function evaluation of stacked dies. In Annual IEEE Semiconductor Thermal Measurement and Management Symposium. Vol. 20. 2004. p. 50-54
Rencz, M. ; Székely, V. / Structure function evaluation of stacked dies. Annual IEEE Semiconductor Thermal Measurement and Management Symposium. Vol. 20 2004. pp. 50-54
@inproceedings{d427ab43397f485e816e6988a566ff79,
title = "Structure function evaluation of stacked dies",
abstract = "In this paper simulation experiments demonstrate, that the structure function evaluation of the thermal transient testing is capable to locate die attach failure(s) of stacked die packages. The strength and the location of the die attach failure may be determined with the methodology of a fast thermal transient measurement and the subsequent computer evaluation. The special advantage of the methodology is that normally it does not require any additional circuit elements on any of the dies of the stacked die structure. The paper demonstrates the feasibility of the method both for stacked die structures of the same die size, and for pyramidal stacked die packages.",
keywords = "Die attach quality, Reliability testing, Structure function, Thermal transient testing",
author = "M. Rencz and V. Sz{\'e}kely",
year = "2004",
language = "English",
volume = "20",
pages = "50--54",
booktitle = "Annual IEEE Semiconductor Thermal Measurement and Management Symposium",

}

TY - GEN

T1 - Structure function evaluation of stacked dies

AU - Rencz, M.

AU - Székely, V.

PY - 2004

Y1 - 2004

N2 - In this paper simulation experiments demonstrate, that the structure function evaluation of the thermal transient testing is capable to locate die attach failure(s) of stacked die packages. The strength and the location of the die attach failure may be determined with the methodology of a fast thermal transient measurement and the subsequent computer evaluation. The special advantage of the methodology is that normally it does not require any additional circuit elements on any of the dies of the stacked die structure. The paper demonstrates the feasibility of the method both for stacked die structures of the same die size, and for pyramidal stacked die packages.

AB - In this paper simulation experiments demonstrate, that the structure function evaluation of the thermal transient testing is capable to locate die attach failure(s) of stacked die packages. The strength and the location of the die attach failure may be determined with the methodology of a fast thermal transient measurement and the subsequent computer evaluation. The special advantage of the methodology is that normally it does not require any additional circuit elements on any of the dies of the stacked die structure. The paper demonstrates the feasibility of the method both for stacked die structures of the same die size, and for pyramidal stacked die packages.

KW - Die attach quality

KW - Reliability testing

KW - Structure function

KW - Thermal transient testing

UR - http://www.scopus.com/inward/record.url?scp=2342646748&partnerID=8YFLogxK

UR - http://www.scopus.com/inward/citedby.url?scp=2342646748&partnerID=8YFLogxK

M3 - Conference contribution

AN - SCOPUS:2342646748

VL - 20

SP - 50

EP - 54

BT - Annual IEEE Semiconductor Thermal Measurement and Management Symposium

ER -