Structural studies of the Cu-Mn system

E. M. Nicht, G. Brauer, Z. Kajcsos, B. Molnar

Research output: Chapter in Book/Report/Conference proceedingChapter

Abstract

The superstructures Cu3Mn and Cu5Mn have been characterized for the first time by X-ray and Differential-Scanning-Calorimetry (DSC) measurements. In addition, positron lifetime measurements are presented in order to show the defect structure of these alloys.

Original languageEnglish
Title of host publicationMaterials Science Forum
PublisherTrans Tech Publ
Pages465-468
Number of pages4
Volume175-178
Editionpt 1
Publication statusPublished - 1995
EventProceedings of the 10th International Conference on Positron Annihilation. Part 1 (of 2) - Beijing, China
Duration: May 23 1994May 29 1994

Other

OtherProceedings of the 10th International Conference on Positron Annihilation. Part 1 (of 2)
CityBeijing, China
Period5/23/945/29/94

Fingerprint

Defect structures
Positrons
Differential scanning calorimetry
X rays

ASJC Scopus subject areas

  • Materials Science(all)

Cite this

Nicht, E. M., Brauer, G., Kajcsos, Z., & Molnar, B. (1995). Structural studies of the Cu-Mn system. In Materials Science Forum (pt 1 ed., Vol. 175-178, pp. 465-468). Trans Tech Publ.

Structural studies of the Cu-Mn system. / Nicht, E. M.; Brauer, G.; Kajcsos, Z.; Molnar, B.

Materials Science Forum. Vol. 175-178 pt 1. ed. Trans Tech Publ, 1995. p. 465-468.

Research output: Chapter in Book/Report/Conference proceedingChapter

Nicht, EM, Brauer, G, Kajcsos, Z & Molnar, B 1995, Structural studies of the Cu-Mn system. in Materials Science Forum. pt 1 edn, vol. 175-178, Trans Tech Publ, pp. 465-468, Proceedings of the 10th International Conference on Positron Annihilation. Part 1 (of 2), Beijing, China, 5/23/94.
Nicht EM, Brauer G, Kajcsos Z, Molnar B. Structural studies of the Cu-Mn system. In Materials Science Forum. pt 1 ed. Vol. 175-178. Trans Tech Publ. 1995. p. 465-468
Nicht, E. M. ; Brauer, G. ; Kajcsos, Z. ; Molnar, B. / Structural studies of the Cu-Mn system. Materials Science Forum. Vol. 175-178 pt 1. ed. Trans Tech Publ, 1995. pp. 465-468
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