SIS SSI - A tool for dynamic electro-thermal simulation of analog VLSI cells

V. Székely, A. Pahi, A. Poppe, M. Rencz, A. Csendes

Research output: Chapter in Book/Report/Conference proceedingConference contribution

Abstract

With the decreasing feature sizes and increasing packaging densities thermal effects influence more and more the operation of integrated circuits. The accurate consideration of thermal effects while predicting the electrical behaviour of the ICs became crucial in case of high performance integrated circuits both for analog and digital ones. The SISSSI electro-thermal simulator family can be applied for the above purpose, both for analog and digital designs. The common feature of the SISSSI versions (SISSSI- Classic and SISSSl-Logitherm) is that they construct the layout based thermal model of the IC automatically and consider accurately the effect of the chip encapsulation as well.

Original languageEnglish
Title of host publicationProceedings of the 1997 European Conference on Design and Test, EDTC 1997
PublisherAssociation for Computing Machinery, Inc
Number of pages1
ISBN (Electronic)0818677864, 9780818677861
Publication statusPublished - Mar 17 1997
Event1997 European Conference on Design and Test, EDTC 1997 - Paris, France
Duration: Mar 17 1997Mar 20 1997

Other

Other1997 European Conference on Design and Test, EDTC 1997
CountryFrance
CityParis
Period3/17/973/20/97

Fingerprint

Thermal effects
Integrated circuits
Encapsulation
Packaging
Simulators
Hot Temperature

ASJC Scopus subject areas

  • Control and Systems Engineering
  • Computer Science(all)

Cite this

Székely, V., Pahi, A., Poppe, A., Rencz, M., & Csendes, A. (1997). SIS SSI - A tool for dynamic electro-thermal simulation of analog VLSI cells. In Proceedings of the 1997 European Conference on Design and Test, EDTC 1997 Association for Computing Machinery, Inc.

SIS SSI - A tool for dynamic electro-thermal simulation of analog VLSI cells. / Székely, V.; Pahi, A.; Poppe, A.; Rencz, M.; Csendes, A.

Proceedings of the 1997 European Conference on Design and Test, EDTC 1997. Association for Computing Machinery, Inc, 1997.

Research output: Chapter in Book/Report/Conference proceedingConference contribution

Székely, V, Pahi, A, Poppe, A, Rencz, M & Csendes, A 1997, SIS SSI - A tool for dynamic electro-thermal simulation of analog VLSI cells. in Proceedings of the 1997 European Conference on Design and Test, EDTC 1997. Association for Computing Machinery, Inc, 1997 European Conference on Design and Test, EDTC 1997, Paris, France, 3/17/97.
Székely V, Pahi A, Poppe A, Rencz M, Csendes A. SIS SSI - A tool for dynamic electro-thermal simulation of analog VLSI cells. In Proceedings of the 1997 European Conference on Design and Test, EDTC 1997. Association for Computing Machinery, Inc. 1997
Székely, V. ; Pahi, A. ; Poppe, A. ; Rencz, M. ; Csendes, A. / SIS SSI - A tool for dynamic electro-thermal simulation of analog VLSI cells. Proceedings of the 1997 European Conference on Design and Test, EDTC 1997. Association for Computing Machinery, Inc, 1997.
@inproceedings{386fc17ccc934bb5afbf81735ab961eb,
title = "SIS SSI - A tool for dynamic electro-thermal simulation of analog VLSI cells",
abstract = "With the decreasing feature sizes and increasing packaging densities thermal effects influence more and more the operation of integrated circuits. The accurate consideration of thermal effects while predicting the electrical behaviour of the ICs became crucial in case of high performance integrated circuits both for analog and digital ones. The SISSSI electro-thermal simulator family can be applied for the above purpose, both for analog and digital designs. The common feature of the SISSSI versions (SISSSI- Classic and SISSSl-Logitherm) is that they construct the layout based thermal model of the IC automatically and consider accurately the effect of the chip encapsulation as well.",
author = "V. Sz{\'e}kely and A. Pahi and A. Poppe and M. Rencz and A. Csendes",
year = "1997",
month = "3",
day = "17",
language = "English",
booktitle = "Proceedings of the 1997 European Conference on Design and Test, EDTC 1997",
publisher = "Association for Computing Machinery, Inc",

}

TY - GEN

T1 - SIS SSI - A tool for dynamic electro-thermal simulation of analog VLSI cells

AU - Székely, V.

AU - Pahi, A.

AU - Poppe, A.

AU - Rencz, M.

AU - Csendes, A.

PY - 1997/3/17

Y1 - 1997/3/17

N2 - With the decreasing feature sizes and increasing packaging densities thermal effects influence more and more the operation of integrated circuits. The accurate consideration of thermal effects while predicting the electrical behaviour of the ICs became crucial in case of high performance integrated circuits both for analog and digital ones. The SISSSI electro-thermal simulator family can be applied for the above purpose, both for analog and digital designs. The common feature of the SISSSI versions (SISSSI- Classic and SISSSl-Logitherm) is that they construct the layout based thermal model of the IC automatically and consider accurately the effect of the chip encapsulation as well.

AB - With the decreasing feature sizes and increasing packaging densities thermal effects influence more and more the operation of integrated circuits. The accurate consideration of thermal effects while predicting the electrical behaviour of the ICs became crucial in case of high performance integrated circuits both for analog and digital ones. The SISSSI electro-thermal simulator family can be applied for the above purpose, both for analog and digital designs. The common feature of the SISSSI versions (SISSSI- Classic and SISSSl-Logitherm) is that they construct the layout based thermal model of the IC automatically and consider accurately the effect of the chip encapsulation as well.

UR - http://www.scopus.com/inward/record.url?scp=85029655046&partnerID=8YFLogxK

UR - http://www.scopus.com/inward/citedby.url?scp=85029655046&partnerID=8YFLogxK

M3 - Conference contribution

AN - SCOPUS:85029655046

BT - Proceedings of the 1997 European Conference on Design and Test, EDTC 1997

PB - Association for Computing Machinery, Inc

ER -