Simulation based method to eliminate the effect of electrical transients from thermal transient measurements

Andras Vass-Varnai, Zoltan Sarkany, Attila Szel, M. Rencz

Research output: Chapter in Book/Report/Conference proceedingConference contribution

4 Citations (Scopus)

Abstract

Thermal transient testing is the industry de-facto test method for the identification of junction temperatures and structural defects inside semiconductor devices. Unfortunately, at the beginning of the thermal transient curve in each case an electric effect can be observed, which appears immediately as the unit power step takes place. This electric effect covers the initial phase of thermal transient, and without knowing it the exact temperature of the device cannot be determined. The current industrial methods make a simple correction by cutting the first stage of the thermal measurement, but it is inaccurate, and the correction requires a manual step, therefore it is uncertain. This article describes a methodology to accurately reproduce the thermal transient curve eliminating the effect of the initial electric transients. We approached the problem by using the combination of thermal transient simulation and measurements, fitting the simulated results to the measured curve knowing that the second half of the measured curve certainly reflects the reality.

Original languageEnglish
Title of host publication2014 International Conference on Electronics Packaging, ICEP 2014
PublisherIEEE Computer Society
Pages591-595
Number of pages5
ISBN (Print)9784904090107
DOIs
Publication statusPublished - 2014
Event2014 International Conference on Electronics Packaging, ICEP 2014 - Toyama, Japan
Duration: Apr 23 2014Apr 25 2014

Other

Other2014 International Conference on Electronics Packaging, ICEP 2014
CountryJapan
CityToyama
Period4/23/144/25/14

Fingerprint

Semiconductor devices
Hot Temperature
Temperature
Defects
Testing
Industry

Keywords

  • JEDEC JESD 51-14
  • Thermal transient testing

ASJC Scopus subject areas

  • Electronic, Optical and Magnetic Materials

Cite this

Vass-Varnai, A., Sarkany, Z., Szel, A., & Rencz, M. (2014). Simulation based method to eliminate the effect of electrical transients from thermal transient measurements. In 2014 International Conference on Electronics Packaging, ICEP 2014 (pp. 591-595). [6826748] IEEE Computer Society. https://doi.org/10.1109/ICEP.2014.6826748

Simulation based method to eliminate the effect of electrical transients from thermal transient measurements. / Vass-Varnai, Andras; Sarkany, Zoltan; Szel, Attila; Rencz, M.

2014 International Conference on Electronics Packaging, ICEP 2014. IEEE Computer Society, 2014. p. 591-595 6826748.

Research output: Chapter in Book/Report/Conference proceedingConference contribution

Vass-Varnai, A, Sarkany, Z, Szel, A & Rencz, M 2014, Simulation based method to eliminate the effect of electrical transients from thermal transient measurements. in 2014 International Conference on Electronics Packaging, ICEP 2014., 6826748, IEEE Computer Society, pp. 591-595, 2014 International Conference on Electronics Packaging, ICEP 2014, Toyama, Japan, 4/23/14. https://doi.org/10.1109/ICEP.2014.6826748
Vass-Varnai A, Sarkany Z, Szel A, Rencz M. Simulation based method to eliminate the effect of electrical transients from thermal transient measurements. In 2014 International Conference on Electronics Packaging, ICEP 2014. IEEE Computer Society. 2014. p. 591-595. 6826748 https://doi.org/10.1109/ICEP.2014.6826748
Vass-Varnai, Andras ; Sarkany, Zoltan ; Szel, Attila ; Rencz, M. / Simulation based method to eliminate the effect of electrical transients from thermal transient measurements. 2014 International Conference on Electronics Packaging, ICEP 2014. IEEE Computer Society, 2014. pp. 591-595
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