Short time die attach characterization of semiconductor devices

Péter Szabó, Márta Rencz

Research output: Chapter in Book/Report/Conference proceedingConference contribution

7 Citations (Scopus)

Abstract

Thermal qualification of the die attach of semiconductor devices is a very important element in the device characterization as the temperature of the chip is strongly affected by the quality of the die attach. Voids or delaminations in this layer may cause higher temperature elevation and thus damage or shorter lifetime. Thermal test of each device in the manufacturing process would be the best solution for eliminating the devices with wrong die attach layer. In this paper we will present the short time thermal transient measurement method and the structure function evaluation through simulations and measurements for die attach characterization. We will also present a method for eliminating the very time consuming calibration process. Using the proposed methods even the in-line testing of LEDs can be accomplished.

Original languageEnglish
Title of host publicationCollection of Papers Presented at The 13th International Workshop on THERMal INvestigation of Ics and Systems, THERMINIC 2007
Pages12-17
Number of pages6
DOIs
Publication statusPublished - Dec 1 2007
Event13th International Workshop on THERMal INvestigation of ICs and Systems, THERMINIC 2007 - Budapest, Hungary
Duration: Sep 17 2007Sep 19 2007

Publication series

NameCollection of Papers Presented at The 13th International Workshop on THERMal INvestigation of ICs and Systems, THERMINIC

Other

Other13th International Workshop on THERMal INvestigation of ICs and Systems, THERMINIC 2007
CountryHungary
CityBudapest
Period9/17/079/19/07

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ASJC Scopus subject areas

  • Electrical and Electronic Engineering
  • Control and Systems Engineering

Cite this

Szabó, P., & Rencz, M. (2007). Short time die attach characterization of semiconductor devices. In Collection of Papers Presented at The 13th International Workshop on THERMal INvestigation of Ics and Systems, THERMINIC 2007 (pp. 12-17). [4451739] (Collection of Papers Presented at The 13th International Workshop on THERMal INvestigation of ICs and Systems, THERMINIC). https://doi.org/10.1109/THERMINIC.2007.4451739