Separation of failure modes in short cycle time power cycling experiments

Zoltán Sárkány, András Vass-Várnai, M. Rencz

Research output: Chapter in Book/Report/Conference proceedingConference contribution

Abstract

Performing active power cycling tests is a commonly used method in the power electronics industry to detect different failure mechanisms in a power device, or to get information on their expected life time. The two major failure mechanisms triggered this way includes bond wire degradation or cracks and die attach problems. During the power cycling test process it is very valuable to detect these failures while they are forming. This way beside the time-to-failure data one can also understand the cause of the failure without any offline inspection. In both cases the assessment can be done based on voltage measurements. In case of bond wire degradation the collector-emitter voltage of the devices will increase, however in case of degradation of the thermal path, a similar elevation in the same voltage parameter can be expected. In this article we will present a combination of two evaluation methods - simple voltage reading and structure function based evaluation, which enables distinguishing between the two effects.

Original languageEnglish
Title of host publicationTHERMINIC 2014 - 20th International Workshop on Thermal Investigations of ICs and Systems, Proceedings
PublisherInstitute of Electrical and Electronics Engineers Inc.
ISBN (Print)9781479954155
DOIs
Publication statusPublished - Dec 2 2014
Event20th International Workshop on Thermal Investigations of ICs and Systems, THERMINIC 2014 - Greenwich, London, United Kingdom
Duration: Sep 24 2014Sep 26 2014

Other

Other20th International Workshop on Thermal Investigations of ICs and Systems, THERMINIC 2014
CountryUnited Kingdom
CityGreenwich, London
Period9/24/149/26/14

Fingerprint

Failure modes
Degradation
Electric potential
Wire
Experiments
Electronics industry
Voltage measurement
Power electronics
Inspection
Cracks
Hot Temperature

ASJC Scopus subject areas

  • Hardware and Architecture
  • Electrical and Electronic Engineering

Cite this

Sárkány, Z., Vass-Várnai, A., & Rencz, M. (2014). Separation of failure modes in short cycle time power cycling experiments. In THERMINIC 2014 - 20th International Workshop on Thermal Investigations of ICs and Systems, Proceedings [6972528] Institute of Electrical and Electronics Engineers Inc.. https://doi.org/10.1109/THERMINIC.2014.6972528

Separation of failure modes in short cycle time power cycling experiments. / Sárkány, Zoltán; Vass-Várnai, András; Rencz, M.

THERMINIC 2014 - 20th International Workshop on Thermal Investigations of ICs and Systems, Proceedings. Institute of Electrical and Electronics Engineers Inc., 2014. 6972528.

Research output: Chapter in Book/Report/Conference proceedingConference contribution

Sárkány, Z, Vass-Várnai, A & Rencz, M 2014, Separation of failure modes in short cycle time power cycling experiments. in THERMINIC 2014 - 20th International Workshop on Thermal Investigations of ICs and Systems, Proceedings., 6972528, Institute of Electrical and Electronics Engineers Inc., 20th International Workshop on Thermal Investigations of ICs and Systems, THERMINIC 2014, Greenwich, London, United Kingdom, 9/24/14. https://doi.org/10.1109/THERMINIC.2014.6972528
Sárkány Z, Vass-Várnai A, Rencz M. Separation of failure modes in short cycle time power cycling experiments. In THERMINIC 2014 - 20th International Workshop on Thermal Investigations of ICs and Systems, Proceedings. Institute of Electrical and Electronics Engineers Inc. 2014. 6972528 https://doi.org/10.1109/THERMINIC.2014.6972528
Sárkány, Zoltán ; Vass-Várnai, András ; Rencz, M. / Separation of failure modes in short cycle time power cycling experiments. THERMINIC 2014 - 20th International Workshop on Thermal Investigations of ICs and Systems, Proceedings. Institute of Electrical and Electronics Engineers Inc., 2014.
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