Selective electrochemical etching for the investigation of solder joint microstructures

Attila Bonyár, Tamás Hurtony, G. Harsányi

Research output: Chapter in Book/Report/Conference proceedingConference contribution

4 Citations (Scopus)

Abstract

Hereby we introduce a method called selective electrochemical etching for the investigation of solder joint microstructures. The aim of this technique is to remove the tin from the solder joint, which enables the examination of the remaining intermetallic microstructures in such a detail, which is unlike to any other previously established method. In our work we discuss the importance of intermetallic compound (IMC) investigation and compare the existing methods with our proposed technique. Pilot measurement results are also presented on selectively etched SAC (Sn-Ag-Cu) alloy solder joints. We present the found relationship between 1) the soldering methods and parameters, 2) the resulting microstructures, 3) the amount of the removed charge/Sn phase during the etching and 4) shear test results on the different solder joints. In our paper we will also investigate the effect of the etching conditions (e.g. etching time, electrolyte concentration, etc.) in order to reach the optimal etching depth, considering the detail and integrity of the intermetallic structures.

Original languageEnglish
Title of host publicationProceedings of the International Spring Seminar on Electronics Technology
Pages89-94
Number of pages6
DOIs
Publication statusPublished - 2012
Event35th International Spring Seminar on Electronics Technology: Power Electronics, ISSE 2012 - Bad Aussee, Austria
Duration: May 9 2012May 13 2012

Other

Other35th International Spring Seminar on Electronics Technology: Power Electronics, ISSE 2012
CountryAustria
CityBad Aussee
Period5/9/125/13/12

Fingerprint

Electrochemical etching
Soldering alloys
Etching
Intermetallics
Microstructure
Soldering
Tin
Electrolytes

ASJC Scopus subject areas

  • Electrical and Electronic Engineering
  • Safety, Risk, Reliability and Quality

Cite this

Bonyár, A., Hurtony, T., & Harsányi, G. (2012). Selective electrochemical etching for the investigation of solder joint microstructures. In Proceedings of the International Spring Seminar on Electronics Technology (pp. 89-94). [6273114] https://doi.org/10.1109/ISSE.2012.6273114

Selective electrochemical etching for the investigation of solder joint microstructures. / Bonyár, Attila; Hurtony, Tamás; Harsányi, G.

Proceedings of the International Spring Seminar on Electronics Technology. 2012. p. 89-94 6273114.

Research output: Chapter in Book/Report/Conference proceedingConference contribution

Bonyár, A, Hurtony, T & Harsányi, G 2012, Selective electrochemical etching for the investigation of solder joint microstructures. in Proceedings of the International Spring Seminar on Electronics Technology., 6273114, pp. 89-94, 35th International Spring Seminar on Electronics Technology: Power Electronics, ISSE 2012, Bad Aussee, Austria, 5/9/12. https://doi.org/10.1109/ISSE.2012.6273114
Bonyár A, Hurtony T, Harsányi G. Selective electrochemical etching for the investigation of solder joint microstructures. In Proceedings of the International Spring Seminar on Electronics Technology. 2012. p. 89-94. 6273114 https://doi.org/10.1109/ISSE.2012.6273114
Bonyár, Attila ; Hurtony, Tamás ; Harsányi, G. / Selective electrochemical etching for the investigation of solder joint microstructures. Proceedings of the International Spring Seminar on Electronics Technology. 2012. pp. 89-94
@inproceedings{46ea580b83a848f985c45c452827a0bd,
title = "Selective electrochemical etching for the investigation of solder joint microstructures",
abstract = "Hereby we introduce a method called selective electrochemical etching for the investigation of solder joint microstructures. The aim of this technique is to remove the tin from the solder joint, which enables the examination of the remaining intermetallic microstructures in such a detail, which is unlike to any other previously established method. In our work we discuss the importance of intermetallic compound (IMC) investigation and compare the existing methods with our proposed technique. Pilot measurement results are also presented on selectively etched SAC (Sn-Ag-Cu) alloy solder joints. We present the found relationship between 1) the soldering methods and parameters, 2) the resulting microstructures, 3) the amount of the removed charge/Sn phase during the etching and 4) shear test results on the different solder joints. In our paper we will also investigate the effect of the etching conditions (e.g. etching time, electrolyte concentration, etc.) in order to reach the optimal etching depth, considering the detail and integrity of the intermetallic structures.",
author = "Attila Bony{\'a}r and Tam{\'a}s Hurtony and G. Hars{\'a}nyi",
year = "2012",
doi = "10.1109/ISSE.2012.6273114",
language = "English",
isbn = "9781467322409",
pages = "89--94",
booktitle = "Proceedings of the International Spring Seminar on Electronics Technology",

}

TY - GEN

T1 - Selective electrochemical etching for the investigation of solder joint microstructures

AU - Bonyár, Attila

AU - Hurtony, Tamás

AU - Harsányi, G.

PY - 2012

Y1 - 2012

N2 - Hereby we introduce a method called selective electrochemical etching for the investigation of solder joint microstructures. The aim of this technique is to remove the tin from the solder joint, which enables the examination of the remaining intermetallic microstructures in such a detail, which is unlike to any other previously established method. In our work we discuss the importance of intermetallic compound (IMC) investigation and compare the existing methods with our proposed technique. Pilot measurement results are also presented on selectively etched SAC (Sn-Ag-Cu) alloy solder joints. We present the found relationship between 1) the soldering methods and parameters, 2) the resulting microstructures, 3) the amount of the removed charge/Sn phase during the etching and 4) shear test results on the different solder joints. In our paper we will also investigate the effect of the etching conditions (e.g. etching time, electrolyte concentration, etc.) in order to reach the optimal etching depth, considering the detail and integrity of the intermetallic structures.

AB - Hereby we introduce a method called selective electrochemical etching for the investigation of solder joint microstructures. The aim of this technique is to remove the tin from the solder joint, which enables the examination of the remaining intermetallic microstructures in such a detail, which is unlike to any other previously established method. In our work we discuss the importance of intermetallic compound (IMC) investigation and compare the existing methods with our proposed technique. Pilot measurement results are also presented on selectively etched SAC (Sn-Ag-Cu) alloy solder joints. We present the found relationship between 1) the soldering methods and parameters, 2) the resulting microstructures, 3) the amount of the removed charge/Sn phase during the etching and 4) shear test results on the different solder joints. In our paper we will also investigate the effect of the etching conditions (e.g. etching time, electrolyte concentration, etc.) in order to reach the optimal etching depth, considering the detail and integrity of the intermetallic structures.

UR - http://www.scopus.com/inward/record.url?scp=84867051098&partnerID=8YFLogxK

UR - http://www.scopus.com/inward/citedby.url?scp=84867051098&partnerID=8YFLogxK

U2 - 10.1109/ISSE.2012.6273114

DO - 10.1109/ISSE.2012.6273114

M3 - Conference contribution

AN - SCOPUS:84867051098

SN - 9781467322409

SP - 89

EP - 94

BT - Proceedings of the International Spring Seminar on Electronics Technology

ER -