Scaling of thermal-electronic logic circuits

J. Mizsei, Márton C. Bein, Jyrki Lappalainen, Ĺaszló Juhász

Research output: Chapter in Book/Report/Conference proceedingConference contribution

Abstract

The thermal-electric logic circuit (TELC) concept is a possible way to overcome the scaling down problems of the conventional CMOS integrated circuits having very complex structure nowadays. The basic component of the TELC is the metal-insulator transition (MIT) switch, which is an extremely simple bulk type device. This work evaluates the effect of the scaling down on the speed of the VO2 thermal-electric switch. Different types (lateral and vertical) of VO2 resistors have been produced by laser ablation. The measured switching time strongly correlates with the characteristic size of the device. The energy consumption (power-delay product) of the scaled-down switching device estimated as a sum of the energy needed for heating the thermal diffusion length sized environment of the device, heating the device itself and the latent heat of phase transition of VO2.

Original languageEnglish
Title of host publicationTHERMINIC 2014 - 20th International Workshop on Thermal Investigations of ICs and Systems, Proceedings
PublisherInstitute of Electrical and Electronics Engineers Inc.
ISBN (Print)9781479954155
DOIs
Publication statusPublished - Dec 2 2014
Event20th International Workshop on Thermal Investigations of ICs and Systems, THERMINIC 2014 - Greenwich, London, United Kingdom
Duration: Sep 24 2014Sep 26 2014

Other

Other20th International Workshop on Thermal Investigations of ICs and Systems, THERMINIC 2014
CountryUnited Kingdom
CityGreenwich, London
Period9/24/149/26/14

Fingerprint

Logic circuits
Electric switches
CMOS integrated circuits
Heating
Metal insulator transition
Thermal diffusion
Latent heat
Laser ablation
Resistors
Energy utilization
Phase transitions
Switches
Hot Temperature

ASJC Scopus subject areas

  • Hardware and Architecture
  • Electrical and Electronic Engineering

Cite this

Mizsei, J., Bein, M. C., Lappalainen, J., & Juhász, Ĺ. (2014). Scaling of thermal-electronic logic circuits. In THERMINIC 2014 - 20th International Workshop on Thermal Investigations of ICs and Systems, Proceedings [6972509] Institute of Electrical and Electronics Engineers Inc.. https://doi.org/10.1109/THERMINIC.2014.6972509

Scaling of thermal-electronic logic circuits. / Mizsei, J.; Bein, Márton C.; Lappalainen, Jyrki; Juhász, Ĺaszló.

THERMINIC 2014 - 20th International Workshop on Thermal Investigations of ICs and Systems, Proceedings. Institute of Electrical and Electronics Engineers Inc., 2014. 6972509.

Research output: Chapter in Book/Report/Conference proceedingConference contribution

Mizsei, J, Bein, MC, Lappalainen, J & Juhász, Ĺ 2014, Scaling of thermal-electronic logic circuits. in THERMINIC 2014 - 20th International Workshop on Thermal Investigations of ICs and Systems, Proceedings., 6972509, Institute of Electrical and Electronics Engineers Inc., 20th International Workshop on Thermal Investigations of ICs and Systems, THERMINIC 2014, Greenwich, London, United Kingdom, 9/24/14. https://doi.org/10.1109/THERMINIC.2014.6972509
Mizsei J, Bein MC, Lappalainen J, Juhász Ĺ. Scaling of thermal-electronic logic circuits. In THERMINIC 2014 - 20th International Workshop on Thermal Investigations of ICs and Systems, Proceedings. Institute of Electrical and Electronics Engineers Inc. 2014. 6972509 https://doi.org/10.1109/THERMINIC.2014.6972509
Mizsei, J. ; Bein, Márton C. ; Lappalainen, Jyrki ; Juhász, Ĺaszló. / Scaling of thermal-electronic logic circuits. THERMINIC 2014 - 20th International Workshop on Thermal Investigations of ICs and Systems, Proceedings. Institute of Electrical and Electronics Engineers Inc., 2014.
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