The thermal-electric logic circuit (TELC) concept is a possible way to overcome the scaling down problems of the conventional CMOS integrated circuits having very complex structure nowadays. The basic component of the TELC is the metal-insulator transition (MIT) switch, which is an extremely simple bulk type device. This work evaluates the effect of the scaling down on the speed of the VO2 thermal-electric switch. Different types (lateral and vertical) of VO2 resistors have been produced by laser ablation. The measured switching time strongly correlates with the characteristic size of the device. The energy consumption (power-delay product) of the scaled-down switching device estimated as a sum of the energy needed for heating the thermal diffusion length sized environment of the device, heating the device itself and the latent heat of phase transition of VO2.