Review of the reliability of advanced component packaging technologies

Pal Nemeth, Zsolt Illyefalvi-Vitez, G. Harsányi

Research output: Chapter in Book/Report/Conference proceedingConference contribution

5 Citations (Scopus)

Abstract

Reliability is one of the most important questions in any applications both on package (component), and on board (system) level. In particular, the reliability requirements of automotive under-hood applications are very severe and diverse. Lifetime of an under-hood electronic unit must be 10...20 years, the operation temperature range is -40...150 C° (depending on the application zone) and the acceleration is 4g...100g. The reliability data presented by different component manufacturers were analyzed, compared and evaluated. From the point of view of the analyzed component types, ball grid array packages (BGAs) are in the focus, since they are being considered as replacements for peripheral-leaded plastic quad flat packs (PQFPs) for most future electronics applications. In general, BGAs include packages made of plastic (PBGA) or ceramic (CBGA) materials, using conventional or tape automated bonding (TAB) construction (TBGA), and of very small dimensions called chip scale packages (CSPs). A multichip module packaged in appropriate format is also considered BGA.

Original languageEnglish
Title of host publicationProceedings - Electronic Components and Technology Conference
PublisherIEEE
Pages1605-1609
Number of pages5
Publication statusPublished - 2000

Fingerprint

Ball grid arrays
Packaging
Chip scale packages
Plastics
Multichip modules
Ceramic materials
Tapes
Electronic equipment
Temperature

ASJC Scopus subject areas

  • Electrical and Electronic Engineering

Cite this

Nemeth, P., Illyefalvi-Vitez, Z., & Harsányi, G. (2000). Review of the reliability of advanced component packaging technologies. In Proceedings - Electronic Components and Technology Conference (pp. 1605-1609). IEEE.

Review of the reliability of advanced component packaging technologies. / Nemeth, Pal; Illyefalvi-Vitez, Zsolt; Harsányi, G.

Proceedings - Electronic Components and Technology Conference. IEEE, 2000. p. 1605-1609.

Research output: Chapter in Book/Report/Conference proceedingConference contribution

Nemeth, P, Illyefalvi-Vitez, Z & Harsányi, G 2000, Review of the reliability of advanced component packaging technologies. in Proceedings - Electronic Components and Technology Conference. IEEE, pp. 1605-1609.
Nemeth P, Illyefalvi-Vitez Z, Harsányi G. Review of the reliability of advanced component packaging technologies. In Proceedings - Electronic Components and Technology Conference. IEEE. 2000. p. 1605-1609
Nemeth, Pal ; Illyefalvi-Vitez, Zsolt ; Harsányi, G. / Review of the reliability of advanced component packaging technologies. Proceedings - Electronic Components and Technology Conference. IEEE, 2000. pp. 1605-1609
@inproceedings{56de85cc98bb47b1af28d1fb7636af9c,
title = "Review of the reliability of advanced component packaging technologies",
abstract = "Reliability is one of the most important questions in any applications both on package (component), and on board (system) level. In particular, the reliability requirements of automotive under-hood applications are very severe and diverse. Lifetime of an under-hood electronic unit must be 10...20 years, the operation temperature range is -40...150 C° (depending on the application zone) and the acceleration is 4g...100g. The reliability data presented by different component manufacturers were analyzed, compared and evaluated. From the point of view of the analyzed component types, ball grid array packages (BGAs) are in the focus, since they are being considered as replacements for peripheral-leaded plastic quad flat packs (PQFPs) for most future electronics applications. In general, BGAs include packages made of plastic (PBGA) or ceramic (CBGA) materials, using conventional or tape automated bonding (TAB) construction (TBGA), and of very small dimensions called chip scale packages (CSPs). A multichip module packaged in appropriate format is also considered BGA.",
author = "Pal Nemeth and Zsolt Illyefalvi-Vitez and G. Hars{\'a}nyi",
year = "2000",
language = "English",
pages = "1605--1609",
booktitle = "Proceedings - Electronic Components and Technology Conference",
publisher = "IEEE",

}

TY - GEN

T1 - Review of the reliability of advanced component packaging technologies

AU - Nemeth, Pal

AU - Illyefalvi-Vitez, Zsolt

AU - Harsányi, G.

PY - 2000

Y1 - 2000

N2 - Reliability is one of the most important questions in any applications both on package (component), and on board (system) level. In particular, the reliability requirements of automotive under-hood applications are very severe and diverse. Lifetime of an under-hood electronic unit must be 10...20 years, the operation temperature range is -40...150 C° (depending on the application zone) and the acceleration is 4g...100g. The reliability data presented by different component manufacturers were analyzed, compared and evaluated. From the point of view of the analyzed component types, ball grid array packages (BGAs) are in the focus, since they are being considered as replacements for peripheral-leaded plastic quad flat packs (PQFPs) for most future electronics applications. In general, BGAs include packages made of plastic (PBGA) or ceramic (CBGA) materials, using conventional or tape automated bonding (TAB) construction (TBGA), and of very small dimensions called chip scale packages (CSPs). A multichip module packaged in appropriate format is also considered BGA.

AB - Reliability is one of the most important questions in any applications both on package (component), and on board (system) level. In particular, the reliability requirements of automotive under-hood applications are very severe and diverse. Lifetime of an under-hood electronic unit must be 10...20 years, the operation temperature range is -40...150 C° (depending on the application zone) and the acceleration is 4g...100g. The reliability data presented by different component manufacturers were analyzed, compared and evaluated. From the point of view of the analyzed component types, ball grid array packages (BGAs) are in the focus, since they are being considered as replacements for peripheral-leaded plastic quad flat packs (PQFPs) for most future electronics applications. In general, BGAs include packages made of plastic (PBGA) or ceramic (CBGA) materials, using conventional or tape automated bonding (TAB) construction (TBGA), and of very small dimensions called chip scale packages (CSPs). A multichip module packaged in appropriate format is also considered BGA.

UR - http://www.scopus.com/inward/record.url?scp=0034480159&partnerID=8YFLogxK

UR - http://www.scopus.com/inward/citedby.url?scp=0034480159&partnerID=8YFLogxK

M3 - Conference contribution

AN - SCOPUS:0034480159

SP - 1605

EP - 1609

BT - Proceedings - Electronic Components and Technology Conference

PB - IEEE

ER -