Reliable aluminum contact formation by electrostatic bonding

T. Kárpáti, A. E. Pap, Gy Radnóczi, B. Beke, I. Bársony, P. Fürjes

Research output: Contribution to journalArticle

1 Citation (Scopus)

Abstract

The paper presents a detailed study of a reliable method developed for aluminum fusion wafer bonding assisted by the electrostatic force evolving during the anodic bonding process. The IC-compatible procedure described allows the parallel formation of electrical and mechanical contacts, facilitating a reliable packaging of electromechanical systems with backside electrical contacts. This fusion bonding method supports the fabrication of complex microelectromechanical systems (MEMS) and micro-opto-electromechanical systems (MOEMS) structures with enhanced temperature stability, which is crucial in mechanical sensor applications such as pressure or force sensors. Due to the applied electrical potential of -1000 V the Al metal layers are compressed by electrostatic force, and at the bonding temperature of 450 °C intermetallic diffusion causes aluminum ions to migrate between metal layers.

Original languageEnglish
Article number075009
JournalJournal of Micromechanics and Microengineering
Volume25
Issue number7
DOIs
Publication statusPublished - Jul 1 2015

Fingerprint

Aluminum
Electrostatics
Electrostatic force
Fusion reactions
Metals
Wafer bonding
Sensors
Intermetallics
MEMS
Packaging
Ions
Fabrication
Temperature

Keywords

  • anodic bonding
  • electrostatic force
  • hybrid bonding
  • MEMS
  • metal fusion bonding

ASJC Scopus subject areas

  • Mechanical Engineering
  • Electrical and Electronic Engineering
  • Mechanics of Materials
  • Electronic, Optical and Magnetic Materials

Cite this

Reliable aluminum contact formation by electrostatic bonding. / Kárpáti, T.; Pap, A. E.; Radnóczi, Gy; Beke, B.; Bársony, I.; Fürjes, P.

In: Journal of Micromechanics and Microengineering, Vol. 25, No. 7, 075009, 01.07.2015.

Research output: Contribution to journalArticle

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AU - Fürjes, P.

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