Reliability testing of TIM materials with thermal transient measurements

Andras Vass-Varnai, Zoltan Sarkany, Marta Rencz

Research output: Chapter in Book/Report/Conference proceedingConference contribution

4 Citations (Scopus)

Abstract

In this paper a power cycling based in-situ reliability testing method is discussed for TIM materials. The material under test is put between the cooling surface of a TO-220 packaged semiconductor device and a cold-plate, like during normal operation while the whole assembly is fixed by a constant force. The heat is generated by powering the device in the package at the junction area. The generated heat is lead through the TIM into the cold-plate. The elevation of the junction temperature is used as a sensor to check the thermal property changes of the TIM. The heating power is cyclically switched on and off, and the junction temperature is measured after each cycle by a thermal transient tester. Slight changes in the junction temperature can be detected which correspond to the structural changes occurring in the heat-flow path. It is verified by the structure functions that the temperature changes originate in fact from the TIM layer.

Original languageEnglish
Title of host publicationEPTC 2009 - Proceedings of 2009 11th Electronic Packaging Technology Conference
Pages823-827
Number of pages5
DOIs
Publication statusPublished - Dec 1 2009
Event2009 11th Electronic Packaging Technology Conference, EPTC 2009 - Singapore, Singapore
Duration: Dec 9 2009Dec 11 2009

Publication series

NameProceedings of the Electronic Packaging Technology Conference, EPTC

Other

Other2009 11th Electronic Packaging Technology Conference, EPTC 2009
CountrySingapore
CitySingapore
Period12/9/0912/11/09

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ASJC Scopus subject areas

  • Electrical and Electronic Engineering
  • Electronic, Optical and Magnetic Materials
  • Condensed Matter Physics

Cite this

Vass-Varnai, A., Sarkany, Z., & Rencz, M. (2009). Reliability testing of TIM materials with thermal transient measurements. In EPTC 2009 - Proceedings of 2009 11th Electronic Packaging Technology Conference (pp. 823-827). [5416437] (Proceedings of the Electronic Packaging Technology Conference, EPTC). https://doi.org/10.1109/EPTC.2009.5416437