Reliability testing of TIM materials with thermal transient measurements

Andras Vass-Varnai, Zoltan Sarkany, M. Rencz

Research output: Chapter in Book/Report/Conference proceedingConference contribution

3 Citations (Scopus)

Abstract

In this paper a power cycling based in-situ reliability testing method is discussed for TIM materials. The material under test is put between the cooling surface of a TO-220 packaged semiconductor device and a cold-plate, like during normal operation while the whole assembly is fixed by a constant force. The heat is generated by powering the device in the package at the junction area. The generated heat is lead through the TIM into the cold-plate. The elevation of the junction temperature is used as a sensor to check the thermal property changes of the TIM. The heating power is cyclically switched on and off, and the junction temperature is measured after each cycle by a thermal transient tester. Slight changes in the junction temperature can be detected which correspond to the structural changes occurring in the heat-flow path. It is verified by the structure functions that the temperature changes originate in fact from the TIM layer.

Original languageEnglish
Title of host publicationProceedings of the Electronic Packaging Technology Conference, EPTC
Pages823-827
Number of pages5
DOIs
Publication statusPublished - 2009
Event2009 11th Electronic Packaging Technology Conference, EPTC 2009 - Singapore, Singapore
Duration: Dec 9 2009Dec 11 2009

Other

Other2009 11th Electronic Packaging Technology Conference, EPTC 2009
CountrySingapore
CitySingapore
Period12/9/0912/11/09

Fingerprint

Testing
surface cooling
heat
Temperature
cycles
temperature
Semiconductor devices
test equipment
semiconductor devices
heat transmission
Thermodynamic properties
thermodynamic properties
assembly
Heat transfer
Cooling
Heating
heating
Hot Temperature
sensors
Sensors

ASJC Scopus subject areas

  • Electrical and Electronic Engineering
  • Electronic, Optical and Magnetic Materials
  • Condensed Matter Physics

Cite this

Vass-Varnai, A., Sarkany, Z., & Rencz, M. (2009). Reliability testing of TIM materials with thermal transient measurements. In Proceedings of the Electronic Packaging Technology Conference, EPTC (pp. 823-827). [5416437] https://doi.org/10.1109/EPTC.2009.5416437

Reliability testing of TIM materials with thermal transient measurements. / Vass-Varnai, Andras; Sarkany, Zoltan; Rencz, M.

Proceedings of the Electronic Packaging Technology Conference, EPTC. 2009. p. 823-827 5416437.

Research output: Chapter in Book/Report/Conference proceedingConference contribution

Vass-Varnai, A, Sarkany, Z & Rencz, M 2009, Reliability testing of TIM materials with thermal transient measurements. in Proceedings of the Electronic Packaging Technology Conference, EPTC., 5416437, pp. 823-827, 2009 11th Electronic Packaging Technology Conference, EPTC 2009, Singapore, Singapore, 12/9/09. https://doi.org/10.1109/EPTC.2009.5416437
Vass-Varnai A, Sarkany Z, Rencz M. Reliability testing of TIM materials with thermal transient measurements. In Proceedings of the Electronic Packaging Technology Conference, EPTC. 2009. p. 823-827. 5416437 https://doi.org/10.1109/EPTC.2009.5416437
Vass-Varnai, Andras ; Sarkany, Zoltan ; Rencz, M. / Reliability testing of TIM materials with thermal transient measurements. Proceedings of the Electronic Packaging Technology Conference, EPTC. 2009. pp. 823-827
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