An experimentally determined relative sputter rate of Cu with respect to Co based on an Auger electron spectroscopy (AES) depth profiling measurement is presented. As such, the width of the Co and Cu layers on the depth profile is used to determine the relative sputter rate. It is found that the relative sputter rate of Cu/Co slowly decreases varying the angle of incidence from 47° to 82° above 82° the relative sputter rate sharply increases.
|Number of pages||5|
|Journal||Journal of Vacuum Science and Technology A: Vacuum, Surfaces and Films|
|Publication status||Published - Jan 1 2003|
ASJC Scopus subject areas
- Condensed Matter Physics
- Surfaces and Interfaces
- Surfaces, Coatings and Films