Relative sputter rate measured in Cu/Co multilayer using Ar+ ion bombardment at grazing angle of incidence

A. Barna, M. Menyhard, G. Zsolt, N. Q. Khanh, A. Zalar, P. Panjan

Research output: Contribution to journalArticle

6 Citations (Scopus)

Abstract

An experimentally determined relative sputter rate of Cu with respect to Co based on an Auger electron spectroscopy (AES) depth profiling measurement is presented. As such, the width of the Co and Cu layers on the depth profile is used to determine the relative sputter rate. It is found that the relative sputter rate of Cu/Co slowly decreases varying the angle of incidence from 47° to 82° above 82° the relative sputter rate sharply increases.

Original languageEnglish
Pages (from-to)196-200
Number of pages5
JournalJournal of Vacuum Science and Technology A: Vacuum, Surfaces and Films
Volume21
Issue number1
DOIs
Publication statusPublished - Jan 1 2003

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ASJC Scopus subject areas

  • Condensed Matter Physics
  • Surfaces and Interfaces
  • Surfaces, Coatings and Films

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