Recent progress of thermal interface material research - an overview

Johan Liu, Bruno Michel, Marta Rencz, Christian Tantolin, Claude Sarno, Ralf Miessner, Klaus Volker Schuett, Xinhe Tang, Sebastien Demoustier, Afshin Ziaei

Research output: Chapter in Book/Report/Conference proceedingConference contribution

36 Citations (Scopus)

Abstract

This paper provides a comprehensive review of the recent progress of research work performed to develop new thermal interface materials. The review starts by classifying existing thermal interface materials and analyzing their advantages and disadvantages. The state of the art research is then reviewed with an emphasis on those materials based on various carbon allotropes, such as graphite, carbon nanotubes (CNTs) and fibers. Other kinds of fillers with high thermal conductivity, such as silicon carbide, boron nitride, aluminum nitride, aluminum oxide, silver and other metals, have also been extensively studied. These materials are also reviewed in this paper. Besides the achievements in materials development, other methods have also been developed to further reduce the overall interface resistance, such as modifying the surfaces of the integrated chips or heat sinks. This aspect is also discussed in this paper. The paper is summarized with a perspective on the future technical trends.

Original languageEnglish
Title of host publication14th International Workshop on Thermal Investigation of ICs and Systems, THERMINIC 2008
Pages156-162
Number of pages7
DOIs
Publication statusPublished - Dec 22 2008
Event14th International Workshop on THERMal INvestigation of ICs and Systems, THERMINIC 2008 - Rome, Italy
Duration: Sep 24 2008Sep 26 2008

Publication series

Name14th International Workshop on THERMal INvestigation of ICs and Systems, THERMINIC 2008

Other

Other14th International Workshop on THERMal INvestigation of ICs and Systems, THERMINIC 2008
CountryItaly
CityRome
Period9/24/089/26/08

ASJC Scopus subject areas

  • Hardware and Architecture
  • Control and Systems Engineering
  • Electrical and Electronic Engineering

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  • Cite this

    Liu, J., Michel, B., Rencz, M., Tantolin, C., Sarno, C., Miessner, R., Schuett, K. V., Tang, X., Demoustier, S., & Ziaei, A. (2008). Recent progress of thermal interface material research - an overview. In 14th International Workshop on Thermal Investigation of ICs and Systems, THERMINIC 2008 (pp. 156-162). [4669900] (14th International Workshop on THERMal INvestigation of ICs and Systems, THERMINIC 2008). https://doi.org/10.1109/THERMINIC.2008.4669900