Processing induced material interactions determining the reliability of LTCC multichip modules

Research output: Contribution to journalArticle

4 Citations (Scopus)

Abstract

Metals can exhibit dendritic short-circuit growth caused by electrochemical migration in conductor-insulator structures, which may result in failures and reliability problems in microcircuits. The classical model of electrochemical migration has been well known for several decades. This process is a transport of metal ions between two metallization stripes under bias through a continuous aqueous electrolyte. Due to the electrochemical deposition at the cathode, dendrites and dendrite-like deposits are formed. Ultimately, such a deposit can lead to a short circuit in the device and can cause catastrophic failure. Recent investigations have demonstrated that not only metallic components, but also oxides from the isolating layers can take part in the formation of migrated shorts, after a chemical reduction process. Material design aspects need to clarify the correlation between material composition, processing, chemical bonding state, and electrochemical migration failure rate in isolating compounds: this is the scope of the present study.

Original languageEnglish
Pages (from-to)339-345
Number of pages7
JournalMicroelectronics Reliability
Volume40
Issue number2
Publication statusPublished - 1999

Fingerprint

Multichip modules
Short circuit currents
Lead deposits
modules
short circuits
dendrites
Processing
Metallizing
deposits
Oxides
Electrolytes
Metal ions
Cathodes
Metals
interactions
microelectronics
metal ions
conductors
cathodes
Chemical analysis

ASJC Scopus subject areas

  • Control and Systems Engineering
  • Electrical and Electronic Engineering

Cite this

Processing induced material interactions determining the reliability of LTCC multichip modules. / Harsányi, G.

In: Microelectronics Reliability, Vol. 40, No. 2, 1999, p. 339-345.

Research output: Contribution to journalArticle

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