Preparation and magnetoresistance characteristics of electrodeposited Ni-Cu alloys and Ni-Cu/Cu multilayers

E. Tóth-Kádár, L. Péter, T. Becsei, J. Tóth, L. Pogány, T. Tarnóczi, P. Kamasa, I. Bakonyi, G. Láng, A. Cziráki, W. Schwarzacher

Research output: Contribution to journalArticle

81 Citations (Scopus)

Abstract

Galvanostatic electrodeposition was used to produce Ni-Cu alloys and Ni81Cu19/Cu multilayers by direct current (dc) plating and two-pulse plating, respectively, from a sulfate/citrate electrolyte. For the dc-plated Ni-Cu alloys, the deposition rate and the alloy composition were established as a function of the deposition current density, from which the appropriate deposition parameters for the constituent sublayers of the multilayers could be established. By measuring the resistivity at room temperature in magnetic fields up to H = 7 kOe, anisotropic magnetoresistance (AMR) was found for Ni81Cu19 electrodeposits, whereas both giant magnetoresistance (GMR) and AMR contributions were observed for most Ni81Cu19/Cu multilayers. Finally, Ni-Cu alloys were also prepared by conventional pulse plating, varying the length of the deposition pulse (on-time) with constant separation (off-time) between the pulses. Clear evidence of a GMR contribution also appeared in these pulse plated Ni-Cu alloys which may be explained by the formation of a Cu enriched layer between the ferromagnetic layers deposited during the cathodic pulses. A quartz crystal microbalance experiment confirmed that an exchange reaction takes place during the off-time. These findings provide useful information on the formation mechanism of multilayers by the two-pulse plating technique.

Original languageEnglish
Pages (from-to)3311-3318
Number of pages8
JournalJournal of the Electrochemical Society
Volume147
Issue number9
DOIs
Publication statusPublished - Sep 2000

Fingerprint

Magnetoresistance
Multilayers
Plating
preparation
Enhanced magnetoresistance
plating
Giant magnetoresistance
pulses
Quartz crystal microbalances
direct current
Deposition rates
Electrodeposition
Citric Acid
Electrolytes
Sulfates
Current density
citrates
quartz crystals
Magnetic fields
electrodeposition

ASJC Scopus subject areas

  • Electrochemistry
  • Surfaces, Coatings and Films
  • Surfaces and Interfaces

Cite this

Preparation and magnetoresistance characteristics of electrodeposited Ni-Cu alloys and Ni-Cu/Cu multilayers. / Tóth-Kádár, E.; Péter, L.; Becsei, T.; Tóth, J.; Pogány, L.; Tarnóczi, T.; Kamasa, P.; Bakonyi, I.; Láng, G.; Cziráki, A.; Schwarzacher, W.

In: Journal of the Electrochemical Society, Vol. 147, No. 9, 09.2000, p. 3311-3318.

Research output: Contribution to journalArticle

@article{677e8684d95f4a06bc309f01b17948e2,
title = "Preparation and magnetoresistance characteristics of electrodeposited Ni-Cu alloys and Ni-Cu/Cu multilayers",
abstract = "Galvanostatic electrodeposition was used to produce Ni-Cu alloys and Ni81Cu19/Cu multilayers by direct current (dc) plating and two-pulse plating, respectively, from a sulfate/citrate electrolyte. For the dc-plated Ni-Cu alloys, the deposition rate and the alloy composition were established as a function of the deposition current density, from which the appropriate deposition parameters for the constituent sublayers of the multilayers could be established. By measuring the resistivity at room temperature in magnetic fields up to H = 7 kOe, anisotropic magnetoresistance (AMR) was found for Ni81Cu19 electrodeposits, whereas both giant magnetoresistance (GMR) and AMR contributions were observed for most Ni81Cu19/Cu multilayers. Finally, Ni-Cu alloys were also prepared by conventional pulse plating, varying the length of the deposition pulse (on-time) with constant separation (off-time) between the pulses. Clear evidence of a GMR contribution also appeared in these pulse plated Ni-Cu alloys which may be explained by the formation of a Cu enriched layer between the ferromagnetic layers deposited during the cathodic pulses. A quartz crystal microbalance experiment confirmed that an exchange reaction takes place during the off-time. These findings provide useful information on the formation mechanism of multilayers by the two-pulse plating technique.",
author = "E. T{\'o}th-K{\'a}d{\'a}r and L. P{\'e}ter and T. Becsei and J. T{\'o}th and L. Pog{\'a}ny and T. Tarn{\'o}czi and P. Kamasa and I. Bakonyi and G. L{\'a}ng and A. Czir{\'a}ki and W. Schwarzacher",
year = "2000",
month = "9",
doi = "10.1149/1.1393900",
language = "English",
volume = "147",
pages = "3311--3318",
journal = "Journal of the Electrochemical Society",
issn = "0013-4651",
publisher = "Electrochemical Society, Inc.",
number = "9",

}

TY - JOUR

T1 - Preparation and magnetoresistance characteristics of electrodeposited Ni-Cu alloys and Ni-Cu/Cu multilayers

AU - Tóth-Kádár, E.

AU - Péter, L.

AU - Becsei, T.

AU - Tóth, J.

AU - Pogány, L.

AU - Tarnóczi, T.

AU - Kamasa, P.

AU - Bakonyi, I.

AU - Láng, G.

AU - Cziráki, A.

AU - Schwarzacher, W.

PY - 2000/9

Y1 - 2000/9

N2 - Galvanostatic electrodeposition was used to produce Ni-Cu alloys and Ni81Cu19/Cu multilayers by direct current (dc) plating and two-pulse plating, respectively, from a sulfate/citrate electrolyte. For the dc-plated Ni-Cu alloys, the deposition rate and the alloy composition were established as a function of the deposition current density, from which the appropriate deposition parameters for the constituent sublayers of the multilayers could be established. By measuring the resistivity at room temperature in magnetic fields up to H = 7 kOe, anisotropic magnetoresistance (AMR) was found for Ni81Cu19 electrodeposits, whereas both giant magnetoresistance (GMR) and AMR contributions were observed for most Ni81Cu19/Cu multilayers. Finally, Ni-Cu alloys were also prepared by conventional pulse plating, varying the length of the deposition pulse (on-time) with constant separation (off-time) between the pulses. Clear evidence of a GMR contribution also appeared in these pulse plated Ni-Cu alloys which may be explained by the formation of a Cu enriched layer between the ferromagnetic layers deposited during the cathodic pulses. A quartz crystal microbalance experiment confirmed that an exchange reaction takes place during the off-time. These findings provide useful information on the formation mechanism of multilayers by the two-pulse plating technique.

AB - Galvanostatic electrodeposition was used to produce Ni-Cu alloys and Ni81Cu19/Cu multilayers by direct current (dc) plating and two-pulse plating, respectively, from a sulfate/citrate electrolyte. For the dc-plated Ni-Cu alloys, the deposition rate and the alloy composition were established as a function of the deposition current density, from which the appropriate deposition parameters for the constituent sublayers of the multilayers could be established. By measuring the resistivity at room temperature in magnetic fields up to H = 7 kOe, anisotropic magnetoresistance (AMR) was found for Ni81Cu19 electrodeposits, whereas both giant magnetoresistance (GMR) and AMR contributions were observed for most Ni81Cu19/Cu multilayers. Finally, Ni-Cu alloys were also prepared by conventional pulse plating, varying the length of the deposition pulse (on-time) with constant separation (off-time) between the pulses. Clear evidence of a GMR contribution also appeared in these pulse plated Ni-Cu alloys which may be explained by the formation of a Cu enriched layer between the ferromagnetic layers deposited during the cathodic pulses. A quartz crystal microbalance experiment confirmed that an exchange reaction takes place during the off-time. These findings provide useful information on the formation mechanism of multilayers by the two-pulse plating technique.

UR - http://www.scopus.com/inward/record.url?scp=0008922925&partnerID=8YFLogxK

UR - http://www.scopus.com/inward/citedby.url?scp=0008922925&partnerID=8YFLogxK

U2 - 10.1149/1.1393900

DO - 10.1149/1.1393900

M3 - Article

AN - SCOPUS:0008922925

VL - 147

SP - 3311

EP - 3318

JO - Journal of the Electrochemical Society

JF - Journal of the Electrochemical Society

SN - 0013-4651

IS - 9

ER -