Preparation and characterization of multilayer graphene by mechanical milling and related applications for ceramic composites

Péter Kun, Orsolya Tapasztó, Zsolt Czigány, Csaba Balázsi

Research output: Chapter in Book/Report/Conference proceedingConference contribution

1 Citation (Scopus)

Abstract

As graphene nanomaterials present exceptional mechanical, thermal and electric properties therefore it can be an excellent reinforcement material for ceramic composites. The research of ceramic composites incorporated with carbon-based fillers has focused on carbon nanotubes until now. In this work silicon nitride-based nanocomposites have been prepared with different ammount (1 and 3 wt%) of multilayer graphene (MLG) made by mechanical milling-based method as well as exfoliated graphite nanoplatelets (xGnP) and nano graphene platelets (Angstron) in comparison. The morphology and microstructure of the sintered samples were studied by scanning electron microscope and transmission electron microscope. Phase compositions were determined by X-ray diffractometer. The bending strength and elastic modulus of MLG-silicon nitride composites showed enhanced values compared to the other graphene reinforced silicon nitride ceramic composites.

Original languageEnglish
Title of host publicationMaterials Science, Testing and Informatics VI
Pages252-259
Number of pages8
DOIs
Publication statusPublished - Jan 1 2013
Event8th Hungarian Conference on Materials Science - Balatonkenese, Hungary
Duration: Oct 9 2011Oct 11 2011

Publication series

NameMaterials Science Forum
Volume729
ISSN (Print)0255-5476

Other

Other8th Hungarian Conference on Materials Science
CountryHungary
CityBalatonkenese
Period10/9/1110/11/11

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Keywords

  • Mechanical properties
  • Multilayer graphene
  • Scanning electron microscopy (SEM)
  • Silicon nitride
  • Transmission electronmicroscope (TEM)
  • X-ray diffraction (XRD)

ASJC Scopus subject areas

  • Materials Science(all)
  • Condensed Matter Physics
  • Mechanics of Materials
  • Mechanical Engineering

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