Practical aspects of thermal transient testing in live digital circuits

Gergely Nagy, Peter Horvath, A. Poppe

Research output: Chapter in Book/Report/Conference proceedingConference contribution

2 Citations (Scopus)

Abstract

Thermal Transient Testing is a method practically used to determine the thermal model of an integrated circuit's case and cooling facilities. The traditional measurement setup of this diagnostic examination does not allow in-circuit testing in case of fully digital semi-custom devices, such as complex programmable logic devices (CPLDs), field programmable gate arrays (FPGAs) and programmable system on a chip devices (PSoCs) because it demands an accessible on-chip p-n junction for temperature rise initiation and temperature monitoring. The article presents a proposed novel measurement setup of the thermal transient testing developed for programmable logic devices that implements the required measurement means exploiting the general purpose programmable logic fabric. The main objective of the research is to determine the effects of the interaction between a live digital circuit and the thermal transient testing environment in order to ascertain the feasibility of an on-chip thermal testing facility making possible in-circuit measurements. A simple test environment and the obtained measurement results are presented in order to prove the applicability of the proposed measurement method. The article also presents an application of the logi-thermal simulation method enabling designers to optimize the relative placement of the measurement elements and the user logic. Simulation results showing the application of the method are included in this paper as well.

Original languageEnglish
Title of host publicationTHERMINIC 2013 - 19th International Workshop on Thermal Investigations of ICs and Systems, Proceedings
PublisherIEEE Computer Society
Pages87-91
Number of pages5
DOIs
Publication statusPublished - 2013
Event19th International Workshop on Thermal Investigations of ICs and Systems, THERMINIC 2013 - Berlin, Germany
Duration: Sep 25 2013Sep 27 2013

Other

Other19th International Workshop on Thermal Investigations of ICs and Systems, THERMINIC 2013
CountryGermany
CityBerlin
Period9/25/139/27/13

Fingerprint

Digital circuits
Testing
Logic devices
Networks (circuits)
Hot Temperature
Integrated circuits
Field programmable gate arrays (FPGA)
Cooling
Temperature
Monitoring

ASJC Scopus subject areas

  • Hardware and Architecture

Cite this

Nagy, G., Horvath, P., & Poppe, A. (2013). Practical aspects of thermal transient testing in live digital circuits. In THERMINIC 2013 - 19th International Workshop on Thermal Investigations of ICs and Systems, Proceedings (pp. 87-91). [6675227] IEEE Computer Society. https://doi.org/10.1109/THERMINIC.2013.6675227

Practical aspects of thermal transient testing in live digital circuits. / Nagy, Gergely; Horvath, Peter; Poppe, A.

THERMINIC 2013 - 19th International Workshop on Thermal Investigations of ICs and Systems, Proceedings. IEEE Computer Society, 2013. p. 87-91 6675227.

Research output: Chapter in Book/Report/Conference proceedingConference contribution

Nagy, G, Horvath, P & Poppe, A 2013, Practical aspects of thermal transient testing in live digital circuits. in THERMINIC 2013 - 19th International Workshop on Thermal Investigations of ICs and Systems, Proceedings., 6675227, IEEE Computer Society, pp. 87-91, 19th International Workshop on Thermal Investigations of ICs and Systems, THERMINIC 2013, Berlin, Germany, 9/25/13. https://doi.org/10.1109/THERMINIC.2013.6675227
Nagy G, Horvath P, Poppe A. Practical aspects of thermal transient testing in live digital circuits. In THERMINIC 2013 - 19th International Workshop on Thermal Investigations of ICs and Systems, Proceedings. IEEE Computer Society. 2013. p. 87-91. 6675227 https://doi.org/10.1109/THERMINIC.2013.6675227
Nagy, Gergely ; Horvath, Peter ; Poppe, A. / Practical aspects of thermal transient testing in live digital circuits. THERMINIC 2013 - 19th International Workshop on Thermal Investigations of ICs and Systems, Proceedings. IEEE Computer Society, 2013. pp. 87-91
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