Polystyrene films as barrier layers for corrosion protection of copper and copper alloys

Loránd Románszki, Iaryna Datsenko, Zoltán May, J. Telegdi, L. Nyikos, Wolfgang Sand

Research output: Contribution to journalArticle

10 Citations (Scopus)

Abstract

Dip-coated polystyrene layers of sub-micrometre thickness (85-500nm) have been applied on copper and copper alloys (aluminium brass, copper-nickel 70/30), as well as on stainless steel 304, and produced an effective barrier against corrosion and adhesion of corrosion-relevant microorganisms. According to the dynamic wettability measurements, the coatings exhibited high advancing (103°), receding (79°) and equilibrium (87°) contact angles, low contact angle hysteresis (6°) and surface free energy (31mJ/m2). The corrosion rate of copper-nickel 70/30 alloy samples in 3.5% NaCl was as low as 3.2μm/a (44% of that of the uncoated samples), and in artificial seawater was only 0.9μm/a (29% of that of the uncoated samples). Cell adhesion was studied by fluorescence microscopy, using monoculture of Desulfovibrio alaskensis. The coatings not only decreased the corrosion rate but also markedly reduced the number of bacterial cells adhered to the coated surfaces. The PS coating on copper gave the best result, 2×103cells/cm2 (1% of that of the uncoated control).

Original languageEnglish
Pages (from-to)7-14
Number of pages8
JournalBioelectrochemistry
Volume97
DOIs
Publication statusPublished - 2014

Fingerprint

Corrosion
copper alloys
Polystyrenes
Copper alloys
Corrosion protection
barrier layers
Copper
polystyrene
corrosion
copper
Nickel
Corrosion rate
coatings
Coatings
Contact angle
adhesion
nickel
Aluminum copper alloys
Desulfovibrio
Fluorescence microscopy

Keywords

  • Aluminium brass
  • Copper-nickel
  • Desulfovibrio alaskensis
  • Microbial corrosion
  • Nanolayer

ASJC Scopus subject areas

  • Biophysics
  • Electrochemistry
  • Physical and Theoretical Chemistry

Cite this

Polystyrene films as barrier layers for corrosion protection of copper and copper alloys. / Románszki, Loránd; Datsenko, Iaryna; May, Zoltán; Telegdi, J.; Nyikos, L.; Sand, Wolfgang.

In: Bioelectrochemistry, Vol. 97, 2014, p. 7-14.

Research output: Contribution to journalArticle

Románszki, Loránd ; Datsenko, Iaryna ; May, Zoltán ; Telegdi, J. ; Nyikos, L. ; Sand, Wolfgang. / Polystyrene films as barrier layers for corrosion protection of copper and copper alloys. In: Bioelectrochemistry. 2014 ; Vol. 97. pp. 7-14.
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