High-purity float zone (FZ) silicon p- and n-type wafers were directly bonded hydrophobically at 700°C and 1050°C. Electrical I-V and capacitance-voltage (C-V) characterization was performed on p-n junctions of 2-mm square chips cut out from properly bonded areas of the wafers. The point defects were investigated by Deep Level Transient Spectroscopy (DLTS). As expected, annealing at 700°C resulted in high void density, while at 1050°C void-free bonded structures were formed. The I-V characteristics were dominated by recombination at the bonded interface and by the resistance of the n-type wafer. The point defects identified by DLTS are divacancy, vacancy-phosphor, and vacancy-oxygen complexes. These defects explain qualitatively the observed characteristics of the samples.
- Point defects
- Wafer bonding
ASJC Scopus subject areas
- Electronic, Optical and Magnetic Materials
- Condensed Matter Physics
- Electrical and Electronic Engineering
- Materials Chemistry