Palladium thin film deposition on polyimide by CW Ar+ laser radiation for electroless copper plating

K. Kordás, S. Leppävuori, A. Uusimäki, Thomas F. George, L. Nánai, R. Vajtai, K. Bali, J. Békési

Research output: Contribution to journalArticle

37 Citations (Scopus)

Abstract

Ar+ laser radiation (CW, 488 nm) is used to induce deposition of palladium (Pd) thin films onto polyimide surfaces from palladium-amine {[Pd(NH3)4]2+} solutions. The chemical reaction is carried out by formaldehyde-assisted reduction of palladium-amine complex molecules to metallic Pd, and is localized on the polymer substrate by a focused and scanned Ar+ laser beam. The narrow (6-14 μm), homogeneous and thin (

Original languageEnglish
Pages (from-to)185-188
Number of pages4
JournalThin Solid Films
Volume384
Issue number2
DOIs
Publication statusPublished - Mar 15 2001

Fingerprint

Copper plating
Continuous wave lasers
Electroless plating
Palladium
Laser radiation
plating
polyimides
Polyimides
palladium
laser beams
Thin films
copper
thin films
Amines
amines
formaldehyde
Formaldehyde
Laser beams
Chemical reactions
chemical reactions

ASJC Scopus subject areas

  • Surfaces, Coatings and Films
  • Condensed Matter Physics
  • Surfaces and Interfaces

Cite this

Kordás, K., Leppävuori, S., Uusimäki, A., George, T. F., Nánai, L., Vajtai, R., ... Békési, J. (2001). Palladium thin film deposition on polyimide by CW Ar+ laser radiation for electroless copper plating. Thin Solid Films, 384(2), 185-188. https://doi.org/10.1016/S0040-6090(00)01829-0

Palladium thin film deposition on polyimide by CW Ar+ laser radiation for electroless copper plating. / Kordás, K.; Leppävuori, S.; Uusimäki, A.; George, Thomas F.; Nánai, L.; Vajtai, R.; Bali, K.; Békési, J.

In: Thin Solid Films, Vol. 384, No. 2, 15.03.2001, p. 185-188.

Research output: Contribution to journalArticle

Kordás, K, Leppävuori, S, Uusimäki, A, George, TF, Nánai, L, Vajtai, R, Bali, K & Békési, J 2001, 'Palladium thin film deposition on polyimide by CW Ar+ laser radiation for electroless copper plating', Thin Solid Films, vol. 384, no. 2, pp. 185-188. https://doi.org/10.1016/S0040-6090(00)01829-0
Kordás, K. ; Leppävuori, S. ; Uusimäki, A. ; George, Thomas F. ; Nánai, L. ; Vajtai, R. ; Bali, K. ; Békési, J. / Palladium thin film deposition on polyimide by CW Ar+ laser radiation for electroless copper plating. In: Thin Solid Films. 2001 ; Vol. 384, No. 2. pp. 185-188.
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