Palladium thin film deposition on polyimide by CW Ar+ laser radiation for electroless copper plating

K. Kordás, S. Leppävuori, A. Uusimäki, Thomas F. George, L. Nänai, R. Vajtai, K. Bali, J. Békési

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37 Citations (Scopus)

Abstract

Ar+ laser radiation (CW, 488 nm) is used to induce deposition of palladium (Pd) thin films onto polyimide surfaces from palladium-amine {[Pd(NH3)4]2+} solutions. The chemical reaction is carried out by formaldehyde-assisted reduction of palladium-amine complex molecules to metallic Pd, and is localized on the polymer substrate by a focused and scanned Ar+ laser beam. The narrow (6-14 μm), homogeneous and thin (<50 nm) palladium patterns are found to be excellent catalysts for further copper autocatalytic electroless deposition. Both the Pd and Cu layers are characterized by scanning electron microscopy (equipped with EDAX), a DEKTAK profiler and resistivity measurements.

Original languageEnglish
Pages (from-to)185-188
Number of pages4
JournalThin Solid Films
Volume384
Issue number2
DOIs
Publication statusPublished - Mar 15 2001

ASJC Scopus subject areas

  • Electronic, Optical and Magnetic Materials
  • Surfaces and Interfaces
  • Surfaces, Coatings and Films
  • Metals and Alloys
  • Materials Chemistry

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    Kordás, K., Leppävuori, S., Uusimäki, A., George, T. F., Nänai, L., Vajtai, R., Bali, K., & Békési, J. (2001). Palladium thin film deposition on polyimide by CW Ar+ laser radiation for electroless copper plating. Thin Solid Films, 384(2), 185-188. https://doi.org/10.1016/S0040-6090(00)01829-0