Packaging of a 3-axial piezoresistive force sensor with backside contacts

T. Kárpáti, S. Kulinyi, R. Végvári, J. Ferencz, A. Nagy, A. Pap, G. Battistig

Research output: Contribution to journalArticle

1 Citation (Scopus)

Abstract

In this paper design aspects and challenging packaging solution of a monolithic 3D force sensor will be presented. The previously developed design and process flow (Vázsonyi et al. 123-124:620-626, 2005; Molnár et al. 90:40-43, 2012) were improved by an additional hybrid wafer bonding step of simultaneous anodic and metal bonding processes. This electrostatic force assisted metal bonding can ensure both the mechanical and the electrical integrity of the device. The applied novel process sequence can eliminate the need of a possible flip-chip bonding and chemical-mechanical polishing steps. The applied glass substrate improves the thermal isolation and thermo-mechanical stability of the integrated system considering the thermal expansion coefficients of the chosen glass material and the silicon (Si) only slightly differ minimizing the residual thermo-mechanical stress during the operation.

Original languageEnglish
Pages (from-to)1063-1068
Number of pages6
JournalMicrosystem Technologies
Volume20
Issue number6
DOIs
Publication statusPublished - 2014

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packaging
metal bonding
Packaging
sensors
Sensors
Metals
Wafer bonding
Glass
Chemical mechanical polishing
Electrostatic force
Mechanical stability
glass
Silicon
polishing
integrity
Thermal expansion
thermal expansion
isolation
chips
wafers

ASJC Scopus subject areas

  • Electrical and Electronic Engineering
  • Hardware and Architecture
  • Electronic, Optical and Magnetic Materials
  • Condensed Matter Physics

Cite this

Packaging of a 3-axial piezoresistive force sensor with backside contacts. / Kárpáti, T.; Kulinyi, S.; Végvári, R.; Ferencz, J.; Nagy, A.; Pap, A.; Battistig, G.

In: Microsystem Technologies, Vol. 20, No. 6, 2014, p. 1063-1068.

Research output: Contribution to journalArticle

Kárpáti, T. ; Kulinyi, S. ; Végvári, R. ; Ferencz, J. ; Nagy, A. ; Pap, A. ; Battistig, G. / Packaging of a 3-axial piezoresistive force sensor with backside contacts. In: Microsystem Technologies. 2014 ; Vol. 20, No. 6. pp. 1063-1068.
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