Packaging and thermal evaluation of thermally operated intelligent micropump unit

A. Morrissey, J. Alderman, G. Kelly, Zs Kohári, A. Páhi, M. Rencz

Research output: Contribution to journalArticle

Abstract

After presenting the challenges and solutions of the 3D packaging of a medical implant MEMS device the paper presents thermal simulations on the structure. Using this simulation problem as a case study various features of the SUNRED and SYSTUS 3D simulators are compared in the paper.

Original languageEnglish
Pages (from-to)1109-1114
Number of pages6
JournalMicroelectronics Journal
Volume30
Issue number11
DOIs
Publication statusPublished - Nov 1999

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thermal simulation
packaging
simulators
microelectromechanical systems
MEMS
Packaging
Simulators
evaluation
simulation
Hot Temperature

ASJC Scopus subject areas

  • Control and Systems Engineering
  • Electrical and Electronic Engineering

Cite this

Packaging and thermal evaluation of thermally operated intelligent micropump unit. / Morrissey, A.; Alderman, J.; Kelly, G.; Kohári, Zs; Páhi, A.; Rencz, M.

In: Microelectronics Journal, Vol. 30, No. 11, 11.1999, p. 1109-1114.

Research output: Contribution to journalArticle

Morrissey, A. ; Alderman, J. ; Kelly, G. ; Kohári, Zs ; Páhi, A. ; Rencz, M. / Packaging and thermal evaluation of thermally operated intelligent micropump unit. In: Microelectronics Journal. 1999 ; Vol. 30, No. 11. pp. 1109-1114.
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