Packaging and thermal evaluation of thermally operated intelligent micropump unit

A. Morrissey, J. Alderman, G. Kelly, Zs Kohári, A. Páhi, M. Rencz

Research output: Contribution to journalConference article

Abstract

After presenting the challenges and solutions of the 3D packaging of a medical implant MEMS device the paper presents thermal simulations on the structure. Using this simulation problem as a case study various features of the SUNRED and SYSTUS 3D simulators are compared in the paper.

Original languageEnglish
Pages (from-to)1109-1114
Number of pages6
JournalMicroelectronics Journal
Volume30
Issue number11
DOIs
Publication statusPublished - Nov 1999
EventProceedings of the 1998 Workshop on Thermal Investigations of ICS and Microstructures (THERMINIC) - Cannes, France
Duration: Sep 27 1998Sep 29 1998

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ASJC Scopus subject areas

  • Electronic, Optical and Magnetic Materials
  • Atomic and Molecular Physics, and Optics
  • Condensed Matter Physics
  • Surfaces, Coatings and Films
  • Electrical and Electronic Engineering

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