Packaging and characterization of silicon and SiC-based power inverter module with double sided cooling

Charles Alix Manier, Hermann Oppermann, Lothar Dietrich, Christian Ehrhardt, Zoltán Sárkány, M. Rencz, Bernhard Wunderle, Wilhelm Maurer, Radoslava Mitova, Klaus Dieter Lang

Research output: Chapter in Book/Report/Conference proceedingConference contribution

3 Citations (Scopus)

Abstract

Thermal management and especially cooling attracts more and more attention during phases of conception and fabrication of power modules to increase their field operation time and/or power density. Indeed thermal power losses impact the reliability of power systems, which are in a same time converging towards always higher power density and performances. Since standard solder die attach and wire bonding are reaching their limits, a novel concept of assembly has been realized with double sided cooling (DSC), as fully integrated part of the power module. Half-bridge modules either based on IGBTs and silicon diodes or based on SiC-devices have been assembled by combining Transient Liquid Phase Bonding (TLPB) and Transient Liquid Phase Soldering (TLPS). SiC and silicon wafers were prepared by deposition of a high density area array of Cu posts. In order to switch 1200V / 25A copper posts were electroplated 80 μm in height with a thin tin cap for flip chip bonding by TLPB. To attach a second DCB substrate on the backside, a TLPS paste was used. All interconnects of the modules are formed by intermetallic bonds for the target purpose of increased capability in heat dissipation, improved reliability and higher operation temperatures. Results on fabrication, thermal characterization and active power cycling (ATj = 125 K) are here also reported.

Original languageEnglish
Title of host publicationPCIM Europe 2016; International Exhibition and Conference for Power Electronics, Intelligent Motion, Renewable Energy and Energy Management
PublisherInstitute of Electrical and Electronics Engineers Inc.
Pages1155-1162
Number of pages8
ISBN (Electronic)9783800741861
Publication statusPublished - Jan 1 2016
Event2016 International Exhibition and Conference for Power Electronics, Intelligent Motion, Renewable Energy and Energy Management, PCIM Europe 2016 - Nuremberg, Germany
Duration: May 10 2016May 12 2016

Other

Other2016 International Exhibition and Conference for Power Electronics, Intelligent Motion, Renewable Energy and Energy Management, PCIM Europe 2016
CountryGermany
CityNuremberg
Period5/10/165/12/16

ASJC Scopus subject areas

  • Electrical and Electronic Engineering
  • Control and Optimization
  • Renewable Energy, Sustainability and the Environment
  • Artificial Intelligence
  • Hardware and Architecture
  • Energy Engineering and Power Technology

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  • Cite this

    Manier, C. A., Oppermann, H., Dietrich, L., Ehrhardt, C., Sárkány, Z., Rencz, M., Wunderle, B., Maurer, W., Mitova, R., & Lang, K. D. (2016). Packaging and characterization of silicon and SiC-based power inverter module with double sided cooling. In PCIM Europe 2016; International Exhibition and Conference for Power Electronics, Intelligent Motion, Renewable Energy and Energy Management (pp. 1155-1162). [7499486] Institute of Electrical and Electronics Engineers Inc..