Package hermeticity testing with thermal transient measurements

András Vass-Várnai, Márta Rencz

Research output: Contribution to journalArticle

Abstract

Thermal transient testing, a well known technique for thermal characterization of IC packages (Rencz and Székely 2001) can be a suitable method for detecting hermeticity failures in packaged semiconductor and MEMS devices. In the paper this measuring technique is evaluated. Experiments were done on different measurement setups at different ambient temperature and RH levels. Based on the results, a new method for package hermeticity testing is proposed.

Original languageEnglish
Pages (from-to)1303-1309
Number of pages7
JournalMicrosystem Technologies
Volume15
Issue number8
DOIs
Publication statusPublished - Aug 1 2009

ASJC Scopus subject areas

  • Electronic, Optical and Magnetic Materials
  • Condensed Matter Physics
  • Hardware and Architecture
  • Electrical and Electronic Engineering

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