Thermal transient testing, a well known technique for thermal characterization of IC packages (Rencz and Székely 2001) can be a suitable method for detecting hermeticity failures in packaged semiconductor and MEMS devices. In the paper this measuring technique is evaluated. Experiments were done on different measurement setups at different ambient temperature and RH levels. Based on the results, a new method for package hermeticity testing is proposed.
ASJC Scopus subject areas
- Electronic, Optical and Magnetic Materials
- Condensed Matter Physics
- Hardware and Architecture
- Electrical and Electronic Engineering