Package characterization

Simulations or measurements?

A. Poppe, Andras Vass-Varnai, Gábor Farkas, M. Rencz

Research output: Chapter in Book/Report/Conference proceedingConference contribution

12 Citations (Scopus)

Abstract

As the functionality of thermal simulators gets more and more complex, measurement techniques also improve. Thermal engineers face and increasingly difficult task to make the right selection from the existing tools. In this paper the applicability of the JEDEC JESD 51-1 static measurement method is compared to mainstream simulation tools, especially MCAD or EDA embedded CFD solutions. Both techniques are opposed to each other in terms of required time and other expense factors. In this paper we discuss when different aspects of trade-offs to be made between thermal simulation and physical testing.

Original languageEnglish
Title of host publication10th Electronics Packaging Technology Conference, EPTC 2008
Pages155-160
Number of pages6
DOIs
Publication statusPublished - 2008
Event10th Electronics Packaging Technology Conference, EPTC 2008 - Singapore, Singapore
Duration: Dec 9 2008Dec 12 2008

Other

Other10th Electronics Packaging Technology Conference, EPTC 2008
CountrySingapore
CitySingapore
Period12/9/0812/12/08

Fingerprint

Computational fluid dynamics
Simulators
Engineers
Testing
Hot Temperature

ASJC Scopus subject areas

  • Hardware and Architecture
  • Electrical and Electronic Engineering

Cite this

Poppe, A., Vass-Varnai, A., Farkas, G., & Rencz, M. (2008). Package characterization: Simulations or measurements? In 10th Electronics Packaging Technology Conference, EPTC 2008 (pp. 155-160). [4763427] https://doi.org/10.1109/EPTC.2008.4763427

Package characterization : Simulations or measurements? / Poppe, A.; Vass-Varnai, Andras; Farkas, Gábor; Rencz, M.

10th Electronics Packaging Technology Conference, EPTC 2008. 2008. p. 155-160 4763427.

Research output: Chapter in Book/Report/Conference proceedingConference contribution

Poppe, A, Vass-Varnai, A, Farkas, G & Rencz, M 2008, Package characterization: Simulations or measurements? in 10th Electronics Packaging Technology Conference, EPTC 2008., 4763427, pp. 155-160, 10th Electronics Packaging Technology Conference, EPTC 2008, Singapore, Singapore, 12/9/08. https://doi.org/10.1109/EPTC.2008.4763427
Poppe A, Vass-Varnai A, Farkas G, Rencz M. Package characterization: Simulations or measurements? In 10th Electronics Packaging Technology Conference, EPTC 2008. 2008. p. 155-160. 4763427 https://doi.org/10.1109/EPTC.2008.4763427
Poppe, A. ; Vass-Varnai, Andras ; Farkas, Gábor ; Rencz, M. / Package characterization : Simulations or measurements?. 10th Electronics Packaging Technology Conference, EPTC 2008. 2008. pp. 155-160
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