Optimizing mask materials and laser pattern transfer processing for cheap MCM-L fast prototyping and special sensor applications

G. Harsányi, Z. Illyefalvi-Vitez, J. Pinkola, M. Ruszinko, E. Toth

Research output: Chapter in Book/Report/Conference proceedingConference contribution

1 Citation (Scopus)

Abstract

The need for fast and cheap prototyping becomes increasingly important in the production of MCMs. A prototyping process should fulfil a number of special requirements. A new approach has been developed for prototyping of MCM-Ls. It combines the advantages of laser direct writing and wet chemical etching. Several processing solutions have been developed and compared. The results of resolution and cross-section investigations, as well as morphology and material analysis results are shown in the paper. A special application of laser direct patterning for sensor purposes is also demonstrated.

Original languageEnglish
Title of host publicationProceedings - 1998 International Conference on Multichip Modules and High Density Packaging
PublisherInstitute of Electrical and Electronics Engineers Inc.
Pages460-465
Number of pages6
Volume1998-April
ISBN (Electronic)0780348508, 9780780348509
DOIs
Publication statusPublished - Jan 1 1998
Event7th International Conference and Exhibition on Multichip Modules and High Density Packaging, MM-HDP 1998 - Denver, United States
Duration: Apr 17 1998 → …

Other

Other7th International Conference and Exhibition on Multichip Modules and High Density Packaging, MM-HDP 1998
CountryUnited States
CityDenver
Period4/17/98 → …

Fingerprint

Multicarrier modulation
Masks
Wet etching
Lasers
Sensors
Processing

Keywords

  • fast prototyping
  • gas sensor patterning
  • laser patterning
  • low cost MCM
  • MCM-L
  • PWB

ASJC Scopus subject areas

  • Electrical and Electronic Engineering
  • Electronic, Optical and Magnetic Materials

Cite this

Harsányi, G., Illyefalvi-Vitez, Z., Pinkola, J., Ruszinko, M., & Toth, E. (1998). Optimizing mask materials and laser pattern transfer processing for cheap MCM-L fast prototyping and special sensor applications. In Proceedings - 1998 International Conference on Multichip Modules and High Density Packaging (Vol. 1998-April, pp. 460-465). Institute of Electrical and Electronics Engineers Inc.. https://doi.org/10.1109/ICMCM.1998.670824

Optimizing mask materials and laser pattern transfer processing for cheap MCM-L fast prototyping and special sensor applications. / Harsányi, G.; Illyefalvi-Vitez, Z.; Pinkola, J.; Ruszinko, M.; Toth, E.

Proceedings - 1998 International Conference on Multichip Modules and High Density Packaging. Vol. 1998-April Institute of Electrical and Electronics Engineers Inc., 1998. p. 460-465.

Research output: Chapter in Book/Report/Conference proceedingConference contribution

Harsányi, G, Illyefalvi-Vitez, Z, Pinkola, J, Ruszinko, M & Toth, E 1998, Optimizing mask materials and laser pattern transfer processing for cheap MCM-L fast prototyping and special sensor applications. in Proceedings - 1998 International Conference on Multichip Modules and High Density Packaging. vol. 1998-April, Institute of Electrical and Electronics Engineers Inc., pp. 460-465, 7th International Conference and Exhibition on Multichip Modules and High Density Packaging, MM-HDP 1998, Denver, United States, 4/17/98. https://doi.org/10.1109/ICMCM.1998.670824
Harsányi G, Illyefalvi-Vitez Z, Pinkola J, Ruszinko M, Toth E. Optimizing mask materials and laser pattern transfer processing for cheap MCM-L fast prototyping and special sensor applications. In Proceedings - 1998 International Conference on Multichip Modules and High Density Packaging. Vol. 1998-April. Institute of Electrical and Electronics Engineers Inc. 1998. p. 460-465 https://doi.org/10.1109/ICMCM.1998.670824
Harsányi, G. ; Illyefalvi-Vitez, Z. ; Pinkola, J. ; Ruszinko, M. ; Toth, E. / Optimizing mask materials and laser pattern transfer processing for cheap MCM-L fast prototyping and special sensor applications. Proceedings - 1998 International Conference on Multichip Modules and High Density Packaging. Vol. 1998-April Institute of Electrical and Electronics Engineers Inc., 1998. pp. 460-465
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