Optimization of flip-chip laser soldering for low temperature stability substrate

Tamás Hurtony, Bálint Balogh, P. Gordon

Research output: Chapter in Book/Report/Conference proceedingConference contribution

1 Citation (Scopus)

Abstract

Interconnect technology is becoming increasingly more complex due to miniaturization of surface mount devices. These trends in electronics industry have led to the demand for new, highly controllable selective soldering technologies. Laser soldering methods can be an adequate answer for the mentioned demands. Optimization of laser soldering process is extremely important especially when there are more than 100°C difference between the temperature limit of the substrate and the melting point of the solder eg. PMMA substrate (Tg∼105°C) and SnAgCu solder (MP=217°C). Temperature distribution of the laser soldered structure can be simulated by our model which also considers reflection, absorption and transmission as well as the Gaussian energy distribution of the beam, beyond the thermal properties of the sample. Simulations and experiments were carried out at frequency trippled Nd:YAG laser wavelength (355 nm) by direct heating of the flip-chip. Soldering process parameters (pulse energy, average power, soldering time, beam intensity) were optimized based on both the simulation and experimental results. The solder joints were qualified by resistance measurements, X-ray micrographs, micro-sections and shear tests.

Original languageEnglish
Title of host publication2009 European Microelectronics and Packaging Conference, EMPC 2009
Publication statusPublished - 2009
Event2009 European Microelectronics and Packaging Conference, EMPC 2009 - Rimini, Italy
Duration: Jun 15 2009Jun 18 2009

Other

Other2009 European Microelectronics and Packaging Conference, EMPC 2009
CountryItaly
CityRimini
Period6/15/096/18/09

Fingerprint

Soldering
Lasers
Soldering alloys
Substrates
Temperature
Electronics industry
Melting point
Temperature distribution
Thermodynamic properties
Heating
X rays
Wavelength
Experiments

Keywords

  • Flip-chip
  • Laser soldering
  • Low temperature stability substrate
  • Thermal simulation

ASJC Scopus subject areas

  • Electrical and Electronic Engineering

Cite this

Hurtony, T., Balogh, B., & Gordon, P. (2009). Optimization of flip-chip laser soldering for low temperature stability substrate. In 2009 European Microelectronics and Packaging Conference, EMPC 2009 [5272924]

Optimization of flip-chip laser soldering for low temperature stability substrate. / Hurtony, Tamás; Balogh, Bálint; Gordon, P.

2009 European Microelectronics and Packaging Conference, EMPC 2009. 2009. 5272924.

Research output: Chapter in Book/Report/Conference proceedingConference contribution

Hurtony, T, Balogh, B & Gordon, P 2009, Optimization of flip-chip laser soldering for low temperature stability substrate. in 2009 European Microelectronics and Packaging Conference, EMPC 2009., 5272924, 2009 European Microelectronics and Packaging Conference, EMPC 2009, Rimini, Italy, 6/15/09.
Hurtony T, Balogh B, Gordon P. Optimization of flip-chip laser soldering for low temperature stability substrate. In 2009 European Microelectronics and Packaging Conference, EMPC 2009. 2009. 5272924
Hurtony, Tamás ; Balogh, Bálint ; Gordon, P. / Optimization of flip-chip laser soldering for low temperature stability substrate. 2009 European Microelectronics and Packaging Conference, EMPC 2009. 2009.
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