Optimization of breaking processes in LTCC manufacturing

Eszter Horváth, András Erényi, Attila Gévczy, G. Harsányi

Research output: Chapter in Book/Report/Conference proceedingConference contribution

Abstract

The effect of mechanical relief and dividing parameters of LTCC are investigated. Two mechanical relief techniques - diamond wheel scratching and laser scribing - are discussed in the paper. The parameters of breaking were also examined. Based on these results, the parameters could be optimized, improving the technology of low temperature co-fired ceramic (LTCC) circuit production. With these settings, less production losses could be expected in the field of LTCC technology.

Original languageEnglish
Title of host publication2011 IEEE 17th International Symposium for Design and Technology of Electronics Packages, SIITME 2011 - Conference Proceedings
Pages153-158
Number of pages6
DOIs
Publication statusPublished - 2011
Event2011 IEEE 17th International Symposium for Design and Technology of Electronics Packages, SIITME 2011 - Timisoara
Duration: Oct 20 2011Oct 23 2011

Other

Other2011 IEEE 17th International Symposium for Design and Technology of Electronics Packages, SIITME 2011
CityTimisoara
Period10/20/1110/23/11

Fingerprint

Diamond
Temperature
Diamonds
Wheels
Networks (circuits)
Lasers

Keywords

  • diamond wheel scratching
  • laser scribing
  • LTCC
  • mechanical relief

ASJC Scopus subject areas

  • Electrical and Electronic Engineering
  • Polymers and Plastics

Cite this

Horváth, E., Erényi, A., Gévczy, A., & Harsányi, G. (2011). Optimization of breaking processes in LTCC manufacturing. In 2011 IEEE 17th International Symposium for Design and Technology of Electronics Packages, SIITME 2011 - Conference Proceedings (pp. 153-158). [6102708] https://doi.org/10.1109/SIITME.2011.6102708

Optimization of breaking processes in LTCC manufacturing. / Horváth, Eszter; Erényi, András; Gévczy, Attila; Harsányi, G.

2011 IEEE 17th International Symposium for Design and Technology of Electronics Packages, SIITME 2011 - Conference Proceedings. 2011. p. 153-158 6102708.

Research output: Chapter in Book/Report/Conference proceedingConference contribution

Horváth, E, Erényi, A, Gévczy, A & Harsányi, G 2011, Optimization of breaking processes in LTCC manufacturing. in 2011 IEEE 17th International Symposium for Design and Technology of Electronics Packages, SIITME 2011 - Conference Proceedings., 6102708, pp. 153-158, 2011 IEEE 17th International Symposium for Design and Technology of Electronics Packages, SIITME 2011, Timisoara, 10/20/11. https://doi.org/10.1109/SIITME.2011.6102708
Horváth E, Erényi A, Gévczy A, Harsányi G. Optimization of breaking processes in LTCC manufacturing. In 2011 IEEE 17th International Symposium for Design and Technology of Electronics Packages, SIITME 2011 - Conference Proceedings. 2011. p. 153-158. 6102708 https://doi.org/10.1109/SIITME.2011.6102708
Horváth, Eszter ; Erényi, András ; Gévczy, Attila ; Harsányi, G. / Optimization of breaking processes in LTCC manufacturing. 2011 IEEE 17th International Symposium for Design and Technology of Electronics Packages, SIITME 2011 - Conference Proceedings. 2011. pp. 153-158
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